Supermicro SuperStorage SSG-6029P-E1CR24L

Supermicro SuperStorage SSG-6029P-E1CR24L is a 2U high-density storage platform designed for enterprise environments requiring large-capacity, highly available storage with strong compute resources.

Key hardware specifications

• Processor support: Dual-socket platform with LGA 3647, compatible with 1st and 2nd Gen Intel Xeon Scalable processors (up to 165W TDP per CPU).
• Memory subsystem: 24 DIMM slots, supporting up to 6TB of 3DS ECC RDIMM/LRDIMM DDR4 memory at up to 2933 MHz, enabling large in-memory datasets and cache.
• Form factor: 2U rackmount chassis optimized for storage density and efficient airflow in data center racks.
• Drive bays: 24x hot-swap 3.5" bays with optional 2.5" support, suitable for high-capacity HDDs or SSDs.
• Storage interfaces: SAS3 + SATA3 connectivity for flexible deployment of performance and capacity tiers.
• Expansion slots: 2x PCI-E 3.0 x16 and 1x PCI-E 3.0 x8 for RAID HBAs, additional storage controllers, or high-speed networking adapters.
• Networking: Network connectivity available via SIOM (Supermicro I/O Module) card, allowing flexible selection of Ethernet controller options according to infrastructure requirements.
• M.2 support: No onboard M.2 NVMe slots, focusing the platform on front-accessible hot-swap storage.
• USB connectivity: 3x USB 3.0 ports (2 rear, 1 internal Type A) for service, maintenance, or boot media.
• Power: 2x redundant 1600W power supplies with 80 Plus Titanium efficiency for high reliability and optimized power usage.
• Warranty: 36-month manufacturer warranty.

Operational advantages

• High storage density: 24 hot-swap bays in a 2U chassis provide substantial capacity per rack unit for backup, archive, or software-defined storage.
• Enterprise reliability: Redundant power supplies and hot-swap drive bays support continuous operation and simplified serviceability.
• Scalable performance: Dual Intel Xeon Scalable processors and large memory capacity enable consolidation of storage and compute services on a single platform.
• Flexible integration: PCIe 3.0 expansion and SIOM-based networking allow adaptation to different throughput, latency, and connectivity requirements.
• Energy efficiency: 80 Plus Titanium power supplies help reduce power loss and thermal output, supporting lower operating costs in dense deployments.

This platform is technically oriented toward environments where high-capacity, high-availability storage and robust compute resources are required, such as virtualized infrastructures, data-intensive applications, or software-defined storage stacks, depending on the final configuration.