Supermicro IoT SuperServer SYS-210TP-HPTR
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  • Supermicro IoT SuperServer SYS-210TP-HPTR
  • Supermicro IoT SuperServer SYS-210TP-HPTR

Supermicro IoT SuperServer SYS-210TP-HPTR

SKU: SYS-210TP-HPTR
$6,616.61/brutto
$5,379.36/netto
The Supermicro IoT SuperServer SYS-210TP-HPTR is a 2U rackmount server supporting single-socket LGA 4189 (P+) for 3rd Gen Intel® Xeon® Scalable processors. Equipped with 2TB ECC DDR4-3200 RAM, 6x 2.5" hot-swap drive bays, redundant 2000W power supply, and advanced connectivity, it is suitable for demanding data center and IoT deployments.
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Supermicro IoT SuperServer SYS-210TP-HPTR is engineered for high-performance computing environments requiring reliability and scalability. Designed in a 2U rackmount chassis, it features a single LGA 4189 (P+) CPU socket, supporting 3rd Gen Intel® Xeon® Scalable processors with a maximum TDP of 85W to 270W (contact support if exceeding 240W).

  • Memory: 8 DIMM slots, pre-installed with 2TB 3DS ECC DDR4-3200 RAM (RDIMM/LRDIMM), ensuring data integrity and high capacity for intensive workloads.
  • Storage: 6 x 2.5" hot-swap drive bays with SATA3 interface, enabling flexible storage expansion and easy maintenance.
  • M.2 NVMe: 2 dedicated slots to support high-speed NVMe SSDs for rapid data access.
  • PCIe Expansion: 2 PCIe 4.0 x16 FHHL and 1 PCIe 4.0 x16 LP slots offer versatile options for additional cards, such as network or storage controllers.
  • Connectivity: 2 x SFP+ 10Gb/s network ports provide robust high-speed networking suitable for data-intensive applications; 2 x USB 3.2 Gen 1 ports ensure peripheral compatibility.
  • Power Supply: 2000W redundant power supply guarantees continuous operation and high availability in mission-critical environments.
  • Warranty: Manufacturer-backed 36-month warranty.

This platform is ideal for applications in enterprise data centers, IoT infrastructure, and environments demanding high stability and scalability, while maintaining ease of serviceability and ongoing support.

SYS-210TP-HPTR
5 Items

Data sheet

Socket
LGA 4189 (P+)
Rodzaj obudowy
2U
Ilość gniazd procesorów
1
Rodzina obsługiwanych procesorów
3rd Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
85W-270W, proszę o kontakt mailowy jeśli TDP przekracza 240W
Liczba slotów RAM
8
Pamięci RAM w zestawie
2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM
Zasilacz
2000W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
2,5"
Liczba zatok dyskowych
6
Interfejs dysków
SATA3
Porty USB
2x USB 3.2 Gen. 1
Interfejs PCI
2 PCIe 4.0 x16 FHHL, 1 PCIe 4.0 x16 LP
Złącza internetowe
2x SFP+ 10Gb/s
Liczba złącz M.2 NVMe
2
Gwarancja producenta
36 miesięcy

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