Supermicro SuperServer Rack 2U SYS-6029TP-HC1R | Dual LGA3647, 4TB DDR4, 2200W Redundant PSU
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  • Supermicro SuperServer Rack 2U SYS-6029TP-HC1R | Dual LGA3647, 4TB DDR4, 2200W Redundant PSU

Supermicro SuperServer Rack 2U SYS-6029TP-HC1R

SKU: SYS-6029TP-HC1R
EAN: 672042265534
$6,800.18/brutto
$5,528.60/netto
Supermicro SuperServer SYS-6029TP-HC1R is a 2U dual-socket LGA3647 platform for 1st/2nd Gen Intel Xeon Scalable CPUs (up to 165W TDP), supporting up to 4TB ECC DDR4-2933 RDIMM/LRDIMM across 16 DIMM slots. It offers 3x 3.5" hot-swap bays (SAS3/SATA3), redundant 2x 2200W 80 Plus Titanium PSUs and flexible networking via SIOM card, ideal for dense, high-availability compute nodes.
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The Supermicro SuperServer Rack 2U SYS-6029TP-HC1R is a high-density compute platform designed for data center, virtualization and HPC environments requiring high memory capacity, efficient power delivery and redundant infrastructure.

Based on the LGA 3647 socket, the system supports dual 1st and 2nd Gen Intel Xeon Scalable processors with a maximum TDP of 165W, enabling deployment of multi-core configurations for demanding, parallel workloads.

Key hardware parameters

  • Form factor: 2U rackmount chassis
  • CPU sockets: Dual LGA 3647
  • Supported CPU family: 1st/2nd Gen Intel Xeon Scalable (up to 165W TDP)
  • Memory slots: 16 DIMM sockets
  • Maximum memory capacity: up to 4TB 3DS ECC DDR4-2933 RDIMM/LRDIMM
  • Drive bays: 3x 3.5" hot-swap (optional 2.5" configuration)
  • Drive interfaces: SAS3 + SATA3 (depending on installed backplane and controllers)
  • M.2 NVMe slots: 0
  • PCIe expansion: 2x PCI-E 3.0 x16 (low profile)
  • USB ports: 2x USB 3.0 (rear)
  • Networking: connectivity available via optional SIOM network card
  • Power supplies: 2x 2200W redundant PSUs
  • Power efficiency: 80 Plus Titanium
  • Warranty: 36 months manufacturer warranty

Benefits for infrastructure and operations

  • High compute density: dual-socket architecture with support for Intel Xeon Scalable processors enables consolidation of multiple workloads on a single 2U node.
  • Large memory footprint: up to 4TB ECC DDR4-2933 across 16 slots is suitable for in-memory databases, analytics and virtualization clusters.
  • Redundancy and availability: dual hot-plug 2200W power supplies and hot-swap drive bays help maintain uptime during maintenance or component replacement.
  • Flexible storage: 3x 3.5" hot-swap bays with SAS3/SATA3 support allow configuration for capacity-oriented or performance-oriented storage tiers.
  • Energy efficiency: 80 Plus Titanium certification supports reduced power losses and optimized energy usage in dense rack deployments.
  • Configurable networking: SIOM-based network options allow the platform to be adapted to different bandwidth and port-layout requirements (depending on selected SIOM card).

This platform is suited for environments that prioritize predictable performance, high memory capacity and redundant power, while requiring a compact 2U rack footprint.

SYS-6029TP-HC1R

Data sheet

Socket
LGA 3647
Rodzaj obudowy
2U
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Max. TDP procesora
165W
Liczba slotów RAM
16
Maksymalna pamięć RAM
4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Zasilacz
2200W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
3,5"
Liczba zatok dyskowych
3
Interfejs dysków
SAS3+SATA3
Porty USB
2 USB 3.0 ports (rear)
Interfejs PCI
2x PCI-E 3.0 x16 (LP)
Złącza internetowe
Możliwość zamontowania poprzez kartę SIOM
Liczba złącz M.2 NVMe
0
Liczba zasilaczy
2
Wydajność energetyczna
80 Plus Titanium
Gwarancja producenta
36 miesięcy

Specific References

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