Supermicro Twin SuperServer SYS-620TP-HC8TR
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  • Supermicro Twin SuperServer SYS-620TP-HC8TR
  • Supermicro Twin SuperServer SYS-620TP-HC8TR

Supermicro Twin SuperServer SYS-620TP-HC8TR

SKU: SYS-620TP-HC8TR
$8,948.89/brutto
$7,275.52/netto
The Supermicro Twin SuperServer SYS-620TP-HC8TR is a high-density 2U server supporting up to two 3rd Gen Intel® Xeon® Scalable processors (LGA 4189), 16 DIMM slots for up to 4TB ECC DDR4 RAM, redundant 2200W power supplies, hot-swap drive bays, and advanced connectivity options for demanding enterprise environments.
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Supermicro Twin SuperServer SYS-620TP-HC8TR is engineered for high-performance computing and scalability in data center environments. Designed in a 2U chassis, it provides support for dual 3rd Gen Intel® Xeon® Scalable processors (socket LGA 4189), enabling advanced multi-threaded workloads.

  • Processor Support: Dual LGA 4189 sockets, compatible with up to 185W TDP CPUs (processors not included).
  • Memory: 16 DIMM slots support up to 4TB ECC DDR4 RDIMM memory at 3200/2933/2666MHz, ensuring error-correcting reliability and high capacity for memory-intensive applications.
  • Power & Redundancy: Equipped with redundant 2200W power supplies to maximize uptime and operational continuity.
  • Storage: Three 3.5" hot-swap drive bays with SATA/SAS interfaces, managed by a Broadcom® 3808 SAS3 controller for robust data integrity and flexibility.
  • Expansion & Connectivity: Includes 1 PCI-E 4.0 x16 LP slot, 1 M.2 NVMe slot, and 2 USB 3.0 rear ports for expandability and peripheral integration.
  • Networking: Dual 10Gb/s RJ-45 Ethernet ports provide high-speed data transfer and reliable network access.
  • Warranty: 36-month manufacturer warranty for extended support and reliability assurance.

This platform is suitable for virtualization, cloud computing, and enterprise IT infrastructure where density, performance, and resiliency are critical.

SYS-620TP-HC8TR

Data sheet

Socket
LGA 4189 (P+)
Rodzaj obudowy
2U
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
3rd Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
185W
Liczba slotów RAM
16
Maksymalna pamięć RAM
4TB 3200/2933/2666MHz ECC DDR4 RDIMM
Zasilacz
2200W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
3.5
Liczba zatok dyskowych
3
Interfejs dysków
SATA
Porty USB
2 USB 3.0 ports (rear)
Interfejs PCI
1 PCI-E 4.0 x16 LP
Złącza internetowe
2
Liczba złącz M.2 NVMe
1
Dołączone karty rozszerzeń
Broadcom® 3808 SAS3
Gwarancja producenta
36 miesięcy

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