Supermicro SYS-F629P3-RTBN is a 4U dual-socket LGA 3647 server platform for 1st/2nd Gen Intel Xeon Scalable CPUs (up to 165W TDP). It supports up to 3TB DDR4-2933 ECC RDIMM/LRDIMM across 12 DIMM slots, offers 8x 3.5" hot-swap bays (SATA/SAS or SAS + 2 NVMe), 1x M.2 NVMe, redundant 4x 1200W 80 Plus Titanium PSUs and PCI-E 3.0 x16 LP expansion, enabling high-density, reliable compute and storage.
Supermicro SYS-F629P3-RTBN is a high-density 4U server platform engineered for demanding data center and enterprise workloads. Based on the LGA 3647 socket and dual-processor architecture, it delivers scalable compute performance, high memory capacity and redundant power for continuous operation.
Processor and platform
Socket: LGA 3647
CPU sockets: Dual-socket configuration
Supported CPU family: 1st/2nd Gen. Intel® Xeon® Scalable
Max. CPU TDP: 165W
Form factor: 4U rackmount chassis
This configuration enables deployment of two Intel Xeon Scalable processors, providing a balanced platform for virtualization, private cloud, high-density applications or compute-intensive services.
Memory subsystem
RAM slots: 12 DIMM slots
Maximum memory capacity: up to 3TB
Memory type: 3DS ECC RDIMM/LRDIMM DDR4-2933MHz
The system supports ECC memory modules, which help maintain data integrity and stability in mission-critical environments, while the high capacity allows consolidation of memory-intensive workloads.
Storage and expansion
Drive bay size: 3.5" (optional 2.5")
Hot-swap drive bays: 8x front-access hot-swap
Main/optional drive interfaces: SATA/SAS or SAS + 2 NVMe
M.2 slots: 1x M.2 NVMe
PCI expansion: 1x PCI-E 3.0 x16 low-profile
The combination of 3.5" bays with optional 2.5" support and NVMe capability enables flexible storage configurations, from capacity-oriented SATA/SAS to higher-performance NVMe setups, depending on the selected drives and backplane configuration.
Connectivity and I/O
USB ports: 2x USB 3.0 (rear)
Network: option to install networking via SIOM card
The SIOM (Supermicro I/O Module) option allows adaptable network connectivity, depending on the selected SIOM card, making it possible to align network bandwidth and port configuration with specific deployment requirements.
Power and reliability
Power supply capacity: 1200W
Number of power supplies: 4
Redundant power: Yes
Energy efficiency: 80 Plus Titanium
Manufacturer warranty: 36 months
The 4x 1200W redundant power supplies with 80 Plus Titanium efficiency are designed to reduce energy losses and support high-availability configurations. Redundancy minimizes downtime risk in case of a PSU failure.
Key benefits
Dual-socket Intel Xeon Scalable support for scalable compute performance.
Up to 3TB ECC DDR4 memory capacity for memory-intensive workloads.
Flexible storage with 8x hot-swap bays and NVMe support.
Redundant, high-efficiency 80 Plus Titanium power for continuous operation.
Modular networking via SIOM for adaptable connectivity.
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Supermicro SYS-F629P3-RTBN is a 4U dual-socket LGA 3647 server platform for 1st/2nd Gen Intel Xeon Scalable CPUs (up to 165W TDP). It supports up to 3TB DDR4-2933 ECC RDIMM/LRDIMM across 12 DIMM slots, offers 8x 3.5" hot-swap bays (SATA/SAS or SAS + 2 NVMe), 1x M.2 NVMe, redundant 4x 1200W 80 Plus Titanium PSUs and PCI-E 3.0 x16 LP expansion, enabling high-density, reliable compute and storage.