Supermicro SYS-F629P3-RTBN    
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Supermicro SYS-F629P3-RTBN

SKU: SYS-F629P3-RTBN
EAN: 672042293704
$7,235.79/brutto
$5,882.76/netto
Supermicro SYS-F629P3-RTBN is a 4U dual-socket LGA 3647 server platform for 1st/2nd Gen Intel Xeon Scalable CPUs (up to 165W TDP). It supports up to 3TB DDR4-2933 ECC RDIMM/LRDIMM across 12 DIMM slots, offers 8x 3.5" hot-swap bays (SATA/SAS or SAS + 2 NVMe), 1x M.2 NVMe, redundant 4x 1200W 80 Plus Titanium PSUs and PCI-E 3.0 x16 LP expansion, enabling high-density, reliable compute and storage.
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Supermicro SYS-F629P3-RTBN is a high-density 4U server platform engineered for demanding data center and enterprise workloads. Based on the LGA 3647 socket and dual-processor architecture, it delivers scalable compute performance, high memory capacity and redundant power for continuous operation.

Processor and platform

  • Socket: LGA 3647
  • CPU sockets: Dual-socket configuration
  • Supported CPU family: 1st/2nd Gen. Intel® Xeon® Scalable
  • Max. CPU TDP: 165W
  • Form factor: 4U rackmount chassis

This configuration enables deployment of two Intel Xeon Scalable processors, providing a balanced platform for virtualization, private cloud, high-density applications or compute-intensive services.

Memory subsystem

  • RAM slots: 12 DIMM slots
  • Maximum memory capacity: up to 3TB
  • Memory type: 3DS ECC RDIMM/LRDIMM DDR4-2933MHz

The system supports ECC memory modules, which help maintain data integrity and stability in mission-critical environments, while the high capacity allows consolidation of memory-intensive workloads.

Storage and expansion

  • Drive bay size: 3.5" (optional 2.5")
  • Hot-swap drive bays: 8x front-access hot-swap
  • Main/optional drive interfaces: SATA/SAS or SAS + 2 NVMe
  • M.2 slots: 1x M.2 NVMe
  • PCI expansion: 1x PCI-E 3.0 x16 low-profile

The combination of 3.5" bays with optional 2.5" support and NVMe capability enables flexible storage configurations, from capacity-oriented SATA/SAS to higher-performance NVMe setups, depending on the selected drives and backplane configuration.

Connectivity and I/O

  • USB ports: 2x USB 3.0 (rear)
  • Network: option to install networking via SIOM card

The SIOM (Supermicro I/O Module) option allows adaptable network connectivity, depending on the selected SIOM card, making it possible to align network bandwidth and port configuration with specific deployment requirements.

Power and reliability

  • Power supply capacity: 1200W
  • Number of power supplies: 4
  • Redundant power: Yes
  • Energy efficiency: 80 Plus Titanium
  • Manufacturer warranty: 36 months

The 4x 1200W redundant power supplies with 80 Plus Titanium efficiency are designed to reduce energy losses and support high-availability configurations. Redundancy minimizes downtime risk in case of a PSU failure.

Key benefits

  • Dual-socket Intel Xeon Scalable support for scalable compute performance.
  • Up to 3TB ECC DDR4 memory capacity for memory-intensive workloads.
  • Flexible storage with 8x hot-swap bays and NVMe support.
  • Redundant, high-efficiency 80 Plus Titanium power for continuous operation.
  • Modular networking via SIOM for adaptable connectivity.
SYS-F629P3-RTBN

Data sheet

Socket
LGA 3647
Rodzaj obudowy
4U
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Max. TDP procesora
165W
Liczba slotów RAM
12
Maksymalna pamięć RAM
3TB 3DS ECC RDIMM/LRDIMM DDR4-2933MHz
Zasilacz
1200W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
3,5"
Liczba zatok dyskowych
8
Interfejs dysków
SATA/SAS lub SAS + 2 NVMe
Porty USB
2 USB 3.0 ports (rear)
Interfejs PCI
1x PCI-E 3.0 x16 LP
Złącza internetowe
Możliwość zamontowania poprzez kartę SIOM
Liczba złącz M.2 NVMe
1
Liczba zasilaczy
4
Wydajność energetyczna
80 Plus Titanium
Gwarancja producenta
36 miesięcy

Specific References

upc
672042293704
ean13
672042293704
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