Supermicro SYS-F619P2-RTN

Supermicro SYS-F619P2-RTN is a high-density 4U server platform engineered for demanding, compute- and memory-intensive workloads. It is built around the LGA 3647 socket and supports dual 1st/2nd Gen Intel® Xeon® Scalable processors, delivering robust performance and high reliability in data center environments.

Key technical characteristics

• Processor support: Dual-socket LGA 3647 for 1st/2nd Gen Intel® Xeon® Scalable CPUs with TDP up to 165W, enabling flexible configuration from mainstream to high-performance compute nodes.
• Memory subsystem: 12 DIMM slots with support for up to 3TB of 3DS ECC RDIMM/LRDIMM DDR4-2933 MHz, providing high capacity and data integrity for virtualization, in-memory analytics and database workloads.
• Form factor: 4U rackmount chassis designed for dense deployments and improved serviceability in enterprise racks.
• Storage configuration: 6 x 2.5" hot-swap drive bays with support for SATA and NVMe, as well as SAS + NVMe (depending on installed backplane and controllers). This allows flexible tiered storage configurations and high IOPS setups.
• Additional storage: 1 x M.2 NVMe slot for high-speed OS or cache drive, reducing latency for critical system components.
• Expansion: 1 x PCI Express 3.0 x16 low-profile slot for add-on cards such as high-speed networking, storage controllers or accelerators, depending on deployment needs.
• Networking: Network connectivity can be implemented via an SIOM (Super I/O Module) card, enabling selection of interface type and bandwidth according to infrastructure requirements.
• USB connectivity: 2 x USB 3.0 ports on the rear panel for high-speed external device connectivity and service operations.
• Power subsystem: 4 x 2200W redundant power supplies with 80 Plus Titanium efficiency, designed to deliver high power density and reduced energy losses in continuous operation.
• Redundancy and availability: Redundant power architecture and hot-swap drive bays support continuous uptime and simplified maintenance in mission-critical environments.
• Warranty: 36-month manufacturer warranty, supporting long-term, stable deployment cycles.

Operational benefits

• High compute density: Dual Xeon® Scalable processors with large memory footprint make the platform suitable for consolidated virtualization hosts and compute nodes.
• Flexible storage: Combination of 2.5" hot-swap bays with SATA/NVMe/SAS+NVMe support and an M.2 NVMe slot allows balancing capacity, throughput and latency.
• Energy efficiency: 80 Plus Titanium power supplies help reduce operating costs in large-scale deployments.
• Serviceability: 4U chassis, hot-swap bays and redundant PSUs enable fast component replacement and simplified maintenance.