Supermicro SYS-F619P2-RC1    
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Supermicro SYS-F619P2-RC1

SKU: SYS-F619P2-RC1
EAN: 672042292608
$15,700.21/brutto
$12,764.40/netto
Supermicro SYS-F619P2-RC1 is a 4U dual-socket LGA3647 server platform for 1st/2nd Gen Intel® Xeon® Scalable CPUs (up to 165W TDP). It supports up to 3TB DDR4-2933 ECC RDIMM/LRDIMM across 12 DIMM slots, offers SAS/SATA storage with 6x 2.5" hot-swap bays plus 4x NVMe and 1x M.2 NVMe, and integrates redundant 4x 2200W 80 Plus Titanium PSUs for high energy efficiency and reliability.
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Supermicro SYS-F619P2-RC1 is a high-density 4U server platform designed for demanding data center, virtualization and HPC workloads. It combines dual-socket processing, large memory capacity and flexible storage options in a redundant, energy-efficient chassis.

Processor and platform

  • Socket: LGA 3647
  • CPU support: 1st/2nd Gen Intel® Xeon® Scalable processors
  • Number of CPU sockets: 2 (dual-socket)
  • Maximum CPU TDP: 165W

Memory subsystem

  • Number of DIMM slots: 12
  • Maximum memory capacity: up to 3TB
  • Memory type: 3DS ECC RDIMM/LRDIMM DDR4-2933MHz
  • Error correction: ECC for improved data integrity and system stability

Chassis and storage

  • Form factor: 4U rackmount
  • Drive bay size: 2.5"
  • Hot-swap drive bays: 6x 2.5"
  • Primary/optional drive interfaces: SAS + SATA + 4x NVMe
  • Onboard high-speed storage: 1x M.2 NVMe slot

Expansion and connectivity

  • PCIe expansion: 1x PCI-E 3.0 x16 LP slot
  • USB ports: 2x USB 3.0 (rear)
  • Network connectivity: SIOM slot for flexible network adapter installation

Power and reliability

  • Power supply configuration: 4x redundant power supplies
  • Power rating: 2200W
  • Efficiency: 80 Plus Titanium for optimized energy consumption
  • Redundant power: Yes, enabling continuous operation in case of PSU failure

Service and lifecycle

  • Manufacturer warranty: 36 months

This configuration is suitable for environments that require high compute density, large memory footprint and flexible storage, while maintaining high availability through redundant power and hot-swap drive capabilities.

SYS-F619P2-RC1

Data sheet

Socket
LGA 3647
Rodzaj obudowy
4U
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Max. TDP procesora
165W
Liczba slotów RAM
12
Maksymalna pamięć RAM
3TB 3DS ECC RDIMM/LRDIMM DDR4-2933MHz
Zasilacz
2200W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
2,5"
Liczba zatok dyskowych
6
Interfejs dysków
SAS + SATA +4x NVMe
Porty USB
2 USB 3.0 ports (rear)
Interfejs PCI
1x PCI-E 3.0 x16 LP
Złącza internetowe
Możliwość zamontowania poprzez kartę SIOM
Liczba złącz M.2 NVMe
1
Liczba zasilaczy
4
Wydajność energetyczna
80 Plus Titanium
Gwarancja producenta
36 miesięcy

Specific References

upc
672042292608
ean13
672042292608
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