Supermicro SYS-F619P2-FT

Supermicro SYS-F619P2-FT is a high-density 4U server platform designed for dual-socket Intel Xeon Scalable deployments, combining high memory capacity, flexible storage and redundant, high-efficiency power.

Compute platform

• Socket: LGA 3647
• CPU support: 1st/2nd Gen Intel Xeon Scalable processors
• Number of CPU sockets: Dual
• Max CPU TDP: up to 165W per processor

This configuration allows deployment of dual high-core-count Xeon CPUs for compute-intensive and virtualized workloads while staying within robust thermal and power design limits.

Memory subsystem

• DIMM slots: 12
• Maximum memory: up to 3TB
• Memory type: 3DS ECC RDIMM/LRDIMM DDR4-2933MHz

The platform supports large memory footprints and ECC protection for improved reliability in production environments and data-centric applications.

Storage and expansion

• 2.5" drive bays: 4
• Primary/optional drive interfaces: SATA + NVMe / SAS + NVMe
• M.2 NVMe slots: 2
• PCIe slots: 1x PCI-E 3.0 x16 LP; 1x PCI-E 3.0 x8 MicroLP
• Front USB: 2x USB 3.0 ports

The combination of 2.5" bays with SATA/SAS and NVMe options, plus dedicated M.2 NVMe, enables flexible boot, cache and data-tier configurations. PCIe 3.0 expansion supports additional controllers or accelerators depending on deployment needs.

Networking

• Network connectivity: available via optional SIOM network card

The SIOM approach provides modular network configuration, allowing selection of appropriate network interface options according to infrastructure requirements.

Power and reliability

• Power supply capacity: 2200W
• Number of power supplies: 4
• Redundant power: Yes
• Efficiency: 80 Plus Titanium
• Chassis form factor: 4U
• Manufacturer warranty: 36 months

The redundant 4x 2200W 80 Plus Titanium power subsystem is designed for high availability and energy-efficient operation, reducing power losses and contributing to lower operating costs while maintaining uptime.

Key technical advantages

• Dual-socket Intel Xeon Scalable support for scalable compute performance.
• Up to 3TB ECC DDR4-2933 memory for memory-intensive workloads.
• Flexible storage with 4x 2.5" bays and 2x M.2 NVMe for mixed boot and data configurations.
• Redundant, high-efficiency 80 Plus Titanium power supplies for mission-critical environments.
• Modular networking via SIOM, allowing adaptation to different network infrastructures.