Supermicro SYS-F629P3-RC1B    
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Supermicro SYS-F629P3-RC1B

SKU: SYS-F629P3-RC1B
EAN: 672042293681
$8,599.67/brutto
$6,991.60/netto
The Supermicro SYS-F629P3-RC1B is a 4U dual-socket LGA3647 server platform for 1st/2nd Gen Intel® Xeon® Scalable CPUs (up to 165W TDP). It supports up to 3TB DDR4-2933 ECC RDIMM/LRDIMM across 12 DIMM slots, 8x 3.5" hot-swap bays (SAS3/SATA3, optional 2.5"), 1x M.2 NVMe, redundant 4x 1200W 80 Plus Titanium PSUs and expansion via PCI-E 3.0 x16 LP and SIOM networking.
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Supermicro SYS-F629P3-RC1B is a high-density 4U server platform designed for demanding compute and storage workloads in data center and enterprise environments. It combines dual-socket Intel® Xeon® Scalable processing, high memory capacity and flexible storage with redundant, high-efficiency power.

Processor and platform

  • Socket: LGA 3647
  • CPU support: 1st/2nd Gen Intel® Xeon® Scalable
  • Number of processor sockets: Dual
  • Maximum CPU TDP: up to 165W per processor
  • Form factor: 4U rackmount chassis

Memory subsystem

  • Number of RAM slots: 12 DIMM slots
  • Maximum memory capacity: up to 3TB
  • Supported memory types: 3DS ECC RDIMM/LRDIMM
  • Memory speed: DDR4-2933MHz (depending on CPU and module configuration)
  • Error Correction: ECC for improved reliability and data integrity

Storage and expandability

  • Drive bays: 8x hot-swap bays
  • Drive bay size: 3.5" (optional 2.5" configuration)
  • Primary disk interface: SAS3 + SATA3
  • Optional: up to 2x 2.5" NVMe
  • M.2: 1x M.2 NVMe slot for high-speed OS or cache
  • PCI expansion: 1x PCI-E 3.0 x16 low profile

Connectivity

  • USB: 2x USB 3.0 ports (rear)
  • Networking: connectivity available via optional SIOM network card (flexible NIC configuration depending on installed SIOM module)

Power and reliability

  • Number of power supplies: 4
  • Power rating: 1200W per PSU
  • Redundant power: Yes, redundant configuration for high availability
  • Energy efficiency: 80 Plus Titanium certified for optimized power usage
  • Manufacturer warranty: 36 months

Key benefits

  • High compute density with dual Intel® Xeon® Scalable processors for virtualization, databases and compute-intensive applications.
  • Up to 3TB ECC DDR4 memory capacity for memory-intensive workloads and large in-memory datasets.
  • Flexible storage configuration with 8x hot-swap bays, SAS3/SATA3 support and additional NVMe options for performance tiers.
  • Redundant, Titanium-rated power supplies for maximum uptime and energy efficiency in mission-critical environments.
  • Scalable networking via SIOM, allowing adaptation to different bandwidth and interface requirements.
SYS-F629P3-RC1B

Data sheet

Socket
LGA 3647
Rodzaj obudowy
4U
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Max. TDP procesora
165W
Liczba slotów RAM
12
Maksymalna pamięć RAM
3TB 3DS ECC RDIMM/LRDIMM DDR4-2933MHz
Zasilacz
1200W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
3,5"
Liczba zatok dyskowych
8
Interfejs dysków
SAS
Porty USB
2 USB 3.0 ports (rear)
Interfejs PCI
1x PCI-E 3.0 x16 LP
Złącza internetowe
Możliwość zamontowania poprzez kartę SIOM
Liczba złącz M.2 NVMe
1
Liczba zasilaczy
4
Wydajność energetyczna
80 Plus Titanium
Gwarancja producenta
36 miesięcy

Specific References

upc
672042293681
ean13
672042293681
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