Supermicro SYS-F619P2-RC0    
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Supermicro SYS-F619P2-RC0

SKU: SYS-F619P2-RC0
EAN: 672042292578
$14,406.74/brutto
$11,712.80/netto
The Supermicro SYS-F619P2-RC0 is a 4U dual-socket LGA 3647 server platform for 1st/2nd Gen Intel Xeon Scalable CPUs (up to 165W TDP). It supports up to 3TB DDR4-2933 ECC RDIMM/LRDIMM across 12 DIMM slots, offers 6x 2.5" hot-swap bays (SAS/SATA + 4x NVMe), 1x M.2 NVMe, redundant 4x 2200W 80 Plus Titanium PSUs, and flexible networking via SIOM.
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The Supermicro SYS-F619P2-RC0 is a high-density 4U server platform designed for compute- and memory-intensive workloads. It supports dual LGA 3647 processors from the 1st and 2nd Gen Intel Xeon Scalable family, delivering a robust foundation for virtualization, private cloud, and data-intensive applications.

Key technical specifications

  • Processor support: Dual-socket LGA 3647 for 1st/2nd Gen Intel Xeon Scalable CPUs, up to 165W TDP per processor.
  • Memory subsystem: 12 DIMM slots with support for up to 3TB 3DS ECC RDIMM/LRDIMM DDR4-2933 MHz, enabling high-capacity, error-correcting memory configurations.
  • Chassis format: 4U rackmount enclosure, optimized for serviceability and airflow in dense data center environments.
  • Storage configuration: 6x 2.5" hot-swap drive bays with support for SAS and SATA drives plus 4x NVMe, enabling mixed-performance storage tiers.
  • M.2 expansion: 1x M.2 NVMe slot for high-speed OS or cache drive deployment.
  • PCIe expansion: 1x PCI-E 3.0 x16 low-profile slot for additional controllers or accelerators, depending on configuration.
  • USB connectivity: 2x USB 3.0 ports on the rear panel for service access and peripheral connectivity.
  • Networking: Network interfaces are provided via an optional SIOM card, allowing flexible selection of Ethernet controller type and port configuration.

Power and reliability

  • Power supply configuration: 4x redundant power supplies for high availability in mission-critical deployments.
  • Power rating: 2200W total power capacity, designed to support high CPU and memory configurations.
  • Efficiency: 80 Plus Titanium certification for high energy efficiency and reduced operational costs.
  • Redundancy: Redundant power architecture helps maintain uptime during PSU failure or replacement.

Operational benefits

  • High compute density with dual Intel Xeon Scalable processors for consolidation of workloads.
  • Large memory footprint for in-memory databases, analytics, and virtualization clusters.
  • Flexible storage mix (SAS/SATA plus NVMe) to balance capacity and I/O performance.
  • Modular networking via SIOM, enabling adaptation to different bandwidth and fabric requirements.
  • Redundant, high-efficiency power design to support continuous operation in enterprise environments.
  • Warranty: 36-month manufacturer warranty for long-term hardware lifecycle planning.
SYS-F619P2-RC0

Data sheet

Socket
LGA 3647
Rodzaj obudowy
4U
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Max. TDP procesora
165W
Liczba slotów RAM
12
Maksymalna pamięć RAM
3TB 3DS ECC RDIMM/LRDIMM DDR4-2933MHz
Zasilacz
2200W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
2,5"
Liczba zatok dyskowych
6
Interfejs dysków
SAS + SATA +4x NVMe
Porty USB
2 USB 3.0 ports (rear)
Interfejs PCI
1x PCI-E 3.0 x16 LP
Złącza internetowe
Możliwość zamontowania poprzez kartę SIOM
Liczba złącz M.2 NVMe
1
Liczba zasilaczy
4
Wydajność energetyczna
80 Plus Titanium
Gwarancja producenta
36 miesięcy

Specific References

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672042292578
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672042292578
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