Supermicro Blade SBI-610P-1C2N
zoom_in
  • Obecnie brak na stanie
  • Supermicro Blade SBI-610P-1C2N
  • Supermicro Blade SBI-610P-1C2N

Supermicro Blade SBI-610P-1C2N

SKU: SBI-610P-1C2N
$1,976.15/brutto
$1,606.63/netto
The Supermicro Blade SBI-610P-1C2N is a high-density server platform supporting a single LGA 4189 (P+) socket for 3rd Gen Intel® Xeon® Scalable CPUs (max TDP 270W), up to 4TB ECC DDR4-3200 RAM, dual 2.5" hot-swap drive bays (NVMe/SATA/SAS), RAID support, and advanced network connectivity with 2x SFP28 25Gb/s interfaces.
Quantity
block Obecnie brak na stanie

help_outlineAsk about product

I accept privacy policy rules  

Supermicro Blade SBI-610P-1C2N delivers a robust and scalable blade server solution engineered for modern data center environments. This platform is designed to meet demanding compute and memory requirements while ensuring flexibility in storage and network configurations.

  • Processor Support: Single LGA 4189 (P+) socket, compatible with 3rd Gen Intel® Xeon® Scalable processors (up to 270W TDP). Processor not included.
  • Memory Expansion: 16 DIMM slots supporting up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM, as well as Intel Optane technology, enabling high-capacity and reliable memory configurations.
  • Storage Features: Equipped with 2x 2.5" hot-swap drive bays, supporting NVMe, SATA, and SAS drives for versatile storage options. Includes 1x M.2 NVMe slot for system flexibility. Integrated Broadcom® 3108 RAID controller (2GB cache) supports RAID levels 0, 1, 5, 6, 10, 50, 60, ensuring data redundancy and performance.
  • Networking: Dual SFP28 25Gb/s interfaces provide high-throughput network connectivity, suitable for data-intensive applications.
  • Reliability: Backed by a 36-month manufacturer warranty.

This blade system is suitable for enterprise virtualization, HPC, and scalable cloud environments requiring high memory and advanced storage features. The design ensures efficient resource utilization within blade infrastructures.

SBI-610P-1C2N

Data sheet

Socket
LGA 4189 (P+)
Ilość gniazd procesorów
1
Rodzina obsługiwanych procesorów
3rd Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
270 W
Liczba slotów RAM
16
Maksymalna pamięć RAM
4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM/ Intel Optane
Wielkość kieszeni dyskowych
2,5"
Liczba zatok dyskowych
2
Interfejs dysków
NVMe/SATA/SAS
Złącza internetowe
2x SFP28 25Gb/s
Liczba złącz M.2 NVMe
1
Dołączone karty rozszerzeń
Kontroler RAID Broadcom® 3108 controller (2GB cache); RAID 0, 1, 5, 6, 10, 50, 60
Gwarancja producenta
36 miesięcy

Specific References

New

16 other products in the category

Comments (0)
No customer reviews for the moment.