Supermicro Blade SBI-620P-1C3N
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  • Supermicro Blade SBI-620P-1C3N
  • Supermicro Blade SBI-620P-1C3N

Supermicro Blade SBI-620P-1C3N

SKU: SBI-620P-1C3N
$2,211.93/brutto
$1,798.32/netto
The Supermicro Blade SBI-620P-1C3N is a dual-socket server node supporting 3rd Gen Intel® Xeon® Scalable processors (LGA 4189) with up to 8TB ECC DDR4-3200MHz memory. It offers 3 hot-swap 2.5" drive bays, NVMe/SATA/SAS support, a Broadcom® 3108 RAID controller, and dual 25Gb/s SFP28 network interfaces. Manufacturer warranty: 36 months.
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Supermicro Blade SBI-620P-1C3N is a high-density server blade engineered for demanding enterprise workloads. Designed for data centers requiring high memory capacity and flexible storage options, it offers advanced hardware features and robust reliability.

  • Processor Support: Dual LGA 4189 (P+) sockets for 3rd Gen Intel® Xeon® Scalable processors, supporting up to 270W TDP per CPU (processors not included).
  • Memory: 32 DIMM slots accommodate up to 8TB of 3DS ECC DDR4-3200MHz memory, supporting RDIMM, LRDIMM, and Intel Optane technologies.
  • Storage: Three 2.5" hot-swap drive bays compatible with NVMe, SATA, and SAS drives, enabling versatile storage configurations.
  • RAID Support: Integrated Broadcom® 3108 RAID controller with 2GB cache, supporting RAID levels 0, 1, 5, 6, 10, 50, and 60 for enhanced data protection and performance.
  • Networking: Dual SFP28 ports supporting 25Gb/s each, ensuring high-speed network connectivity for data-intensive applications.
  • Expansion: No onboard M.2 NVMe slots, focusing on traditional 2.5" drive expandability.
  • Warranty: Backed by a 36-month manufacturer warranty for extended operational assurance.

This blade server is suitable for virtualization, database, and high-performance computing scenarios where scalability, memory capacity, and storage flexibility are critical. The system provides advanced manageability and integration potential within Supermicro blade chassis environments.

SBI-620P-1C3N

Data sheet

Socket
LGA 4189 (P+)
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
3rd Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
270 W
Liczba slotów RAM
32
Maksymalna pamięć RAM
8TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM/Intel Optane
Wielkość kieszeni dyskowych
2,5"
Liczba zatok dyskowych
3
Interfejs dysków
NVMe/SATA/SAS
Złącza internetowe
2x SFP28 25Gb/s
Liczba złącz M.2 NVMe
0
Dołączone karty rozszerzeń
Kontroler RAID Broadcom® 3108 controller (2GB cache); RAID 0, 1, 5, 6, 10, 50, 60
Gwarancja producenta
36 miesięcy

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