Supermicro MBD-X11SPG-TF Motherboard

The Supermicro MBD-X11SPG-TF is a high-performance server motherboard engineered for demanding data center, virtualization and compute workloads. Based on the LGA 3647 platform, it supports 1st and 2nd Gen Intel® Xeon® Scalable processors with a maximum TDP of 205W, delivering robust processing power in a single-socket configuration.

The board offers six DIMM slots with support for up to 1.5TB of 3DS ECC DDR4-2933 RDIMM/LRDIMM memory, ensuring high capacity and reliability for memory-intensive applications. ECC support enhances system stability in 24/7 server environments.

Expansion capabilities are provided by three PCI-E 3.0 x16 slots, enabling flexible integration of high-bandwidth devices such as GPUs, high-speed storage controllers or specialized accelerator cards. For fast local storage, the motherboard includes two M.2 NVMe connectors.

Network connectivity is optimized with two RJ-45 10Gb/s ports, enabling high-throughput, low-latency links for virtualization hosts, storage servers and other bandwidth-critical roles.

Comprehensive USB connectivity includes 4x USB 2.0 (2 rear, 2 optional) and 5x USB 3.1 Gen1 (2 rear, 2 optional, 1 Type-A), supporting a wide range of peripherals and service tools.

Key technical features:

• Socket: LGA 3647
• CPU support: 1st/2nd Gen Intel® Xeon® Scalable (single socket)
• Max CPU TDP: 205W
• Form factor dimensions: 7.71" x 16.64" (19.58cm x 42.27cm)
• Memory slots: 6x DIMM
• Max memory: up to 1.5TB 3DS ECC DDR4-2933 RDIMM/LRDIMM
• PCIe expansion: 3x PCI-E 3.0 x16
• Storage: 2x M.2 NVMe connectors
• LAN: 2x RJ-45 10Gb/s
• USB: 4x USB 2.0 (2 rear + 2 optional); 5x USB 3.1 Gen1 (2 rear, 2 optional, 1 Type-A)
• CPU included: No
• Manufacturer warranty: 36 months

This platform is suitable for deployments where high memory density, strong single-socket compute performance and integrated 10GbE networking are required, such as virtualization hosts, application servers and storage gateways.