Supermicro MBD-X11SPW-TF Motherboard LGA3647, Xeon Scalable, 10GbE, up to 1.5TB RAM
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  • Supermicro MBD-X11SPW-TF Motherboard LGA3647, Xeon Scalable, 10GbE, up to 1.5TB RAM

Supermicro MBD-X11SPW-TF Motherboard

SKU: MBD-X11SPW-TF-O
EAN: 672042265381
$593.91/brutto
$482.85/netto
Server-class motherboard with LGA3647 socket for 1st/2nd Gen Intel Xeon Scalable CPUs (up to 205W TDP), supporting up to 1.5TB 3DS ECC DDR4-2933 RDIMM/LRDIMM in 6 DIMM slots. Features 10GbE dual LAN, one M.2 NVMe slot, extensive USB 3.0/2.0 connectivity and PCIe 3.0 expansion for high-performance, reliable data center and enterprise deployments.
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The Supermicro MBD-X11SPW-TF is a server-grade motherboard designed for high-performance, highly available compute platforms based on Intel Xeon Scalable processors. With a robust power design and advanced connectivity, it is suitable for demanding data center, virtualization and enterprise workloads.

Processor and memory subsystem

  • Socket: LGA 3647, supporting single-socket configurations
  • Supported CPU family: 1st and 2nd Gen Intel Xeon Scalable
  • Maximum CPU TDP: 205 W for high-core, high-frequency processors
  • Processor included: not included (requires separate CPU purchase)
  • Memory slots: 6 DIMM for flexible capacity scaling
  • Maximum memory: up to 1.5 TB 3DS ECC DDR4-2933 RDIMM/LRDIMM
  • ECC support for enhanced data integrity and system stability in mission-critical environments

Form factor and expansion

  • Board size: 8" x 13" (20.32 cm x 33.02 cm), suitable for server chassis supporting this format
  • PCIe slots: 1 x PCI-E 3.0 x32 (riser slot) and 1 x PCI-E 3.0 x8 (mechanical x16)
  • Designed for flexible integration of HBAs, RAID controllers, NICs or accelerator cards, depending on chassis and riser configuration

Storage and connectivity

  • M.2: 1 x M.2 NVMe slot for high-speed SSD boot or cache applications
  • Network interfaces: 2 x RJ-45 10 Gb/s LAN ports for high-throughput networking and efficient virtualization or storage traffic
  • USB ports:
    • 5 x USB 3.0 (2 rear, 2 optional, 1 Type-A)
    • 7 x USB 2.0 (2 rear, 5 optional)

Reliability and service

  • Server-class design focused on continuous 24/7 operation
  • Supports ECC memory to reduce risk of data corruption
  • Manufacturer warranty: 36 months

This platform is intended for professional server and workstation builds where stability, memory capacity and 10GbE connectivity are critical. It provides a solid foundation for compute-intensive, virtualized and storage-oriented deployments, assuming compatible chassis, cooling and power delivery are used.

MBD-X11SPW-TF-O

Data sheet

Socket
LGA 3647
Rozmiar płyty:
8" x 13" (20.32cm x 33.02cm)
Ilość gniazd procesorów
1
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
205W
Liczba slotów RAM
6
Maksymalna pamięć RAM
1.5TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Porty USB
5 USB3.0(2 rear + 2 optional + 1 Type A) 7 USB2.0 (2 rear + 5 optional)
Interfejs PCI
1 PCI-E 3.0 x32 (gniazdo na riser); 1 PCI-E 3.0 x8 (slot x16)
Złącza internetowe
2
Liczba złącz M.2 NVMe
1
Gwarancja producenta
36 miesięcy

Specific References

upc
672042265381
ean13
672042265381
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