Server-class motherboard with LGA3647 socket for 1st/2nd Gen Intel Xeon Scalable CPUs (up to 205W TDP), supporting up to 1.5TB 3DS ECC DDR4-2933 RDIMM/LRDIMM in 6 DIMM slots. Features 10GbE dual LAN, one M.2 NVMe slot, extensive USB 3.0/2.0 connectivity and PCIe 3.0 expansion for high-performance, reliable data center and enterprise deployments.
The Supermicro MBD-X11SPW-TF is a server-grade motherboard designed for high-performance, highly available compute platforms based on Intel Xeon Scalable processors. With a robust power design and advanced connectivity, it is suitable for demanding data center, virtualization and enterprise workloads.
Supported CPU family: 1st and 2nd Gen Intel Xeon Scalable
Maximum CPU TDP: 205 W for high-core, high-frequency processors
Processor included: not included (requires separate CPU purchase)
Memory slots: 6 DIMM for flexible capacity scaling
Maximum memory: up to 1.5 TB 3DS ECC DDR4-2933 RDIMM/LRDIMM
ECC support for enhanced data integrity and system stability in mission-critical environments
Form factor and expansion
Board size: 8" x 13" (20.32 cm x 33.02 cm), suitable for server chassis supporting this format
PCIe slots: 1 x PCI-E 3.0 x32 (riser slot) and 1 x PCI-E 3.0 x8 (mechanical x16)
Designed for flexible integration of HBAs, RAID controllers, NICs or accelerator cards, depending on chassis and riser configuration
Storage and connectivity
M.2: 1 x M.2 NVMe slot for high-speed SSD boot or cache applications
Network interfaces: 2 x RJ-45 10 Gb/s LAN ports for high-throughput networking and efficient virtualization or storage traffic
USB ports:
5 x USB 3.0 (2 rear, 2 optional, 1 Type-A)
7 x USB 2.0 (2 rear, 5 optional)
Reliability and service
Server-class design focused on continuous 24/7 operation
Supports ECC memory to reduce risk of data corruption
Manufacturer warranty: 36 months
This platform is intended for professional server and workstation builds where stability, memory capacity and 10GbE connectivity are critical. It provides a solid foundation for compute-intensive, virtualized and storage-oriented deployments, assuming compatible chassis, cooling and power delivery are used.
MBD-X11SPW-TF-O
Data sheet
Socket
LGA 3647
Rozmiar płyty:
8" x 13" (20.32cm x 33.02cm)
Ilość gniazd procesorów
1
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
205W
Liczba slotów RAM
6
Maksymalna pamięć RAM
1.5TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Porty USB
5 USB3.0(2 rear + 2 optional + 1 Type A) 7 USB2.0 (2 rear + 5 optional)
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Server-class motherboard with LGA3647 socket for 1st/2nd Gen Intel Xeon Scalable CPUs (up to 205W TDP), supporting up to 1.5TB 3DS ECC DDR4-2933 RDIMM/LRDIMM in 6 DIMM slots. Features 10GbE dual LAN, one M.2 NVMe slot, extensive USB 3.0/2.0 connectivity and PCIe 3.0 expansion for high-performance, reliable data center and enterprise deployments.