BigTwin SuperServer SYS-621BT-DNC8R
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Supermicro BigTwin SuperServer SYS-621BT-DNC8R

SKU: SYS-621BT-DNC8R
$7,348.12/brutto
$5,974.08/netto
The Supermicro BigTwin SuperServer SYS-621BT-DNC8R is a high-density 2U server supporting dual LGA 4667 (E) sockets for 4th Gen Intel® Xeon® Scalable processors. It features 16 RAM slots for up to 4TB DDR5-4800MHz ECC RDIMM, redundant 2200W power supply, hot-swap storage bays, and advanced PCIe 5.0 expansion. Designed for demanding enterprise applications.
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Supermicro BigTwin SuperServer SYS-621BT-DNC8R is engineered for enterprise workloads requiring high performance, scalability, and reliability. This 2U platform accommodates dual LGA 4667 (E) sockets, supporting the latest 4th Gen Intel® Xeon® Scalable processors (not included).

Key Features:

  • Processor Support: Dual LGA 4667 (E) sockets for 4th Gen Intel® Xeon® Scalable CPUs. Maximum TDP per processor: 205W (air cooling), up to 305W (liquid cooling under specific conditions).
  • Memory: 16 DIMM slots, supporting up to 4TB DDR5-4800MHz ECC RDIMM, enabling high memory bandwidth and reliability.
  • Storage: Six hot-swap 3.5" drive bays with NVMe/SATA compatibility. Two M.2 NVMe slots and Broadcom® 3808 SAS3 controller for advanced storage configurations.
  • Expansion: 2x PCIe 5.0 x8 LP and 1x PCIe 5.0 x16 LP slots for high-speed add-on cards.
  • Power Supply: Redundant 2200W power supplies ensure continuous operation and minimal downtime.
  • I/O Connectivity: 2x USB 3.1 (rear), AIOM card support for flexible network options.
  • Form Factor: 2U rackmount chassis, optimized for data center environments.
  • Warranty: 36 months manufacturer warranty.

This system is ideal for virtualization, cloud, and data-intensive enterprise tasks, providing robust scalability and system integrity. For processors exceeding 205W TDP, liquid cooling is available and specific conditions may apply—please contact support for guidance.

SYS-621BT-DNC8R

Data sheet

Socket
LGA 4667 (E)
Rodzaj obudowy
2U
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
4th Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
205W (chłodzenie powietrzem) procesory z wyższym TDP są wspierane w określonych warunkach, w takich sytuacjach prosimy o kontakt / 305W (chłodzenie cieczą)
Liczba slotów RAM
16
Maksymalna pamięć RAM
4TB DDR5-4800MHz ECC RDIMM
Zasilacz
2200W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
3.5
Liczba zatok dyskowych
6
Interfejs dysków
NVMe/SATA
Porty USB
2x USB 3.1 (rear)
Interfejs PCI
2x PCIe 5.0 x8 LP, 1x PCIe 5.0 x16 LP
Złącza internetowe
Możliwość zamontowania poprzez kartę AIOM
Liczba złącz M.2 NVMe
2
Dołączone karty rozszerzeń
Broadcom® 3808 SAS3
Gwarancja producenta
36 miesięcy

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