Supermicro BigTwin SuperServer SYS-221BT-HNC9R
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  • Supermicro BigTwin SuperServer SYS-221BT-HNC9R
  • Supermicro BigTwin SuperServer SYS-221BT-HNC9R

Supermicro BigTwin SuperServer SYS-221BT-HNC9R

SKU: SYS-221BT-HNC9R
$13,227.72/brutto
$10,754.24/netto
The Supermicro BigTwin SuperServer SYS-221BT-HNC9R is a high-density 2U server chassis supporting dual LGA 4667 sockets for 4th Gen Intel® Xeon® Scalable processors. It offers up to 16 DDR5 RAM slots, redundant 3000W power supply, hot-swap 2.5" drive bays, and advanced PCIe 5.0 expansion, making it suitable for demanding data center environments.
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Supermicro BigTwin SuperServer SYS-221BT-HNC9R is engineered for enterprise-level workloads requiring performance, reliability, and scalability. Its design targets data centers and environments demanding high-density compute and memory configurations.

  • Processor Support: Dual LGA 4667 sockets, compatible with 4th Gen Intel® Xeon® Scalable CPUs. Maximum TDP support is 205W (air cooling) or up to 305W (liquid cooling, under specific conditions).
  • Memory: 16 DIMM slots, supporting up to 4TB DDR5-4800MHz ECC RDIMM, ensuring high bandwidth and reliability.
  • Drive Bays: 6 hot-swap 2.5" bays with NVMe/SAS support, enabling flexible high-speed storage configurations.
  • Expansion: 2 x PCIe 5.0 x16 LP slots for advanced add-in cards and accelerators.
  • M.2 Support: 2 M.2 NVMe slots for fast local storage or caching.
  • Networking: AIOM slot allows custom network interface card installation.
  • Power: Redundant 3000W power supply for enhanced uptime and serviceability.
  • Connectivity: 2 x USB 3.1 (rear) ports.
  • Warranty: 36 months manufacturer warranty for peace of mind and long-term reliability.

This server is designed to deliver optimal performance, flexibility, and serviceability for virtualization, cloud computing, and high-performance applications.

SYS-221BT-HNC9R

Data sheet

Socket
LGA 4667 (E)
Rodzaj obudowy
2U
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
4th Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
205W (chłodzenie powietrzem) procesory z wyższym TDP są wspierane w określonych warunkach, w takich sytuacjach prosimy o kontakt / 305W (chłodzenie cieczą)
Liczba slotów RAM
16
Maksymalna pamięć RAM
4TB DDR5-4800MHz ECC RDIMM
Zasilacz
3000W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
2,5"
Liczba zatok dyskowych
6
Interfejs dysków
NVMe/SAS
Porty USB
2x USB 3.1 (rear)
Interfejs PCI
2x PCIe 5.0 x16 LP
Złącza internetowe
Możliwość zamontowania poprzez kartę AIOM
Liczba złącz M.2 NVMe
2
Gwarancja producenta
36 miesięcy

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