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Supermicro BigTwin SuperServer SYS-221BT-HNTR

SKU: SYS-221BT-HNTR

$10,646.09/brutto

$8,655.36/netto

Supermicro BigTwin SuperServer SYS-221BT-HNTR is a 2U dual-socket server supporting 4th Gen Intel® Xeon® Scalable processors (LGA 4667), up to 4TB DDR5-4800MHz ECC RDIMM, and 6 hot-swap 2.5" drive bays with NVMe/SATA support. Features redundant 3000W power supply and two PCIe 5.0 x16 low-profile slots.

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Description
Product Details

Supermicro BigTwin SuperServer SYS-221BT-HNTR delivers robust performance for demanding data center and enterprise applications. Designed in a 2U chassis, it accommodates dual LGA 4667 sockets for 4th Gen Intel® Xeon® Scalable processors, ensuring high scalability and computational power.

Processor Support: Dual LGA 4667 sockets, compatible with 4th Gen Intel® Xeon® Scalable CPUs. Supports CPUs up to 205W TDP (air cooling), and up to 305W TDP (liquid cooling; higher TDP supported under certain conditions).
Memory: 16 RAM slots, up to 4TB DDR5-4800MHz ECC RDIMM, ensuring high memory bandwidth and error correction for reliability in critical workloads.
Storage: 6 hot-swap 2.5" bays with NVMe/SATA interface, enabling flexible and high-performance storage configurations.
Expansion: Two PCIe 5.0 x16 low-profile slots provide options for additional network, storage, or accelerator cards.
M.2 Support: Two M.2 NVMe slots for fast onboard storage or boot devices.
Power Supply: 3000W redundant power supply maximizes uptime and reliability.
Connectivity: 2x USB 3.1 (rear). Network connectivity available via optional AIOM card installation.
Warranty: Backed by a 36-month manufacturer warranty.

This server is engineered for flexibility, performance, and reliability, making it suitable for virtualization, high-performance computing, and enterprise storage solutions. For processors with higher TDP than standard, contact support for specific configurations.

Reference SYS-221BT-HNTR

Data sheet

Socket: LGA 4667 (E)
Rodzaj obudowy: 2U
Ilość gniazd procesorów: 2
Rodzina obsługiwanych procesorów: 4th Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę: Nie
Max. TDP procesora: 205W (chłodzenie powietrzem) procesory z wyższym TDP są wspierane w określonych warunkach, w takich sytuacjach prosimy o kontakt / 305W (chłodzenie cieczą)
Liczba slotów RAM: 16
Maksymalna pamięć RAM: 4TB DDR5-4800MHz ECC RDIMM
Zasilacz: 3000W
Zasilacz redundantny: Tak
Wielkość kieszeni dyskowych: 2,5"
Liczba zatok dyskowych: 6
Interfejs dysków: NVMe/SATA
Porty USB: 2x USB 3.1 (rear)
Interfejs PCI: 2x PCIe 5.0 x16 LP
Złącza internetowe: Możliwość zamontowania poprzez kartę AIOM
Liczba złącz M.2 NVMe: 2
Gwarancja producenta: 36 miesięcy