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Supermicro IoT SuperServer SYS-220HE-TNRD

SKU: SYS-220HE-TNRD

$4,312.20/brutto

$3,505.85/netto

The Supermicro IoT SuperServer SYS-220HE-TNRD is a 2U rackmount system supporting a single 3rd Gen Intel® Xeon® Scalable processor (LGA 4189) up to 270W TDP. It offers 32 RAM slots for up to 8TB DDR4 memory, redundant 1300W DC power supplies, 6 hot-swap 2.5" drive bays (NVMe/SATA), multiple PCI-E 4.0 x16 slots, and 2 M.2 NVMe interfaces.

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Description
Product Details

Supermicro IoT SuperServer SYS-220HE-TNRD is engineered for high-performance computing and demanding IoT applications. Designed in a compact 2U rackmount chassis, it is compatible with a single 3rd Gen Intel® Xeon® Scalable processor (Socket LGA 4189, TDP up to 270W), providing robust processing power for enterprise workloads.

Memory Capacity: Supports up to 32 DDR4-3200MHz RAM modules, with a maximum of 8TB using Intel® Optane™ 200, 3DS ECC LRDIMM, or RDIMM. This enables large-scale data processing and virtualization.
Storage: Equipped with 6 hot-swap 2.5" drive bays supporting NVMe and SATA drives, allowing for flexible storage configurations and fast data access.
Expansion: Features three PCI-E 4.0 x16 slots for GPU or accelerator cards and an additional optional PCI-E 4.0 x16 slot, enhancing scalability for computational tasks.
Connectivity: Includes two rear USB 3.0 ports and supports network connectivity through an add-on AIOM card (sold separately).
M.2 NVMe: Two M.2 NVMe slots enable ultra-fast storage solutions for caching or OS deployment.
Power Supply: 1300W DC redundant power supplies provide high availability and reliability for mission-critical operations.
Warranty: Backed by a 36-month manufacturer warranty.

This server is suitable for data centers, edge computing, or high-density storage environments requiring reliability, scalability, and efficient resource utilization. Processor is not included in the standard configuration.

Reference SYS-220HE-TNRD

Data sheet

Socket: LGA 4189 (P+)
Rodzaj obudowy: 2U
Ilość gniazd procesorów: 1
Rodzina obsługiwanych procesorów: 3rd Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę: Nie
Max. TDP procesora: 270 W
Liczba slotów RAM: 32
Maksymalna pamięć RAM: 8TB Intel® Optane™ 200 DDR4-3200MHz / 8TB 3DS ECC LRDIMM, DDR4-3200MHz/ 8TB 3DS ECC RDIMM, DDR4- 3200MHz
Zasilacz: 1300W DC
Zasilacz redundantny: Tak
Wielkość kieszeni dyskowych: 2,5"
Liczba zatok dyskowych: 6
Interfejs dysków: NVMe/SATA
Porty USB: 2 USB 3.0 ports (rear)
Interfejs PCI: 5x PCI-E 4.0 x16 DW FHFL or 6x x8 SW FHFL, 1x PCI-E 4.0 x16 SW FHHL or 2x x8 SW FHHL
Złącza internetowe: Możliwość zamontowania poprzez kartę AIOM
Liczba złącz M.2 NVMe: 2
Gwarancja producenta: 36 miesięcy