Supermicro SuperBlade SBI-6119PW-C3N
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  • Supermicro SuperBlade SBI-6119PW-C3N

Supermicro SuperBlade SBI-6119PW-C3N

SKU: SBI-6119PW-C3N
$1,382.54/brutto
$1,124.02/netto
The Supermicro SuperBlade SBI-6119PW-C3N is a single-socket blade server supporting 2nd Gen. Intel Xeon Scalable processors (LGA3647, up to 205W TDP), up to 3TB DDR4 ECC memory (12 slots), and 2.5" drives with flexible NVMe/SAS3/SATA3 configurations. Includes a Broadcom 3108 RAID controller and dual 10Gb/s SFP+ network ports. Manufacturer warranty: 36 months.
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Supermicro SuperBlade SBI-6119PW-C3N is a high-density blade server engineered for enterprise environments requiring optimal compute and memory resources in a compact form factor.

  • Processor Support: Single socket, LGA3647 (P), compatible with 2nd Gen. Intel® Xeon® Scalable CPUs; maximum supported TDP up to 205W. CPU not included.
  • Memory Capacity: Supports up to 3TB of 3DS ECC RDIMM/LRDIMM DDR4-2933MHz across 12 DIMM slots, ensuring high memory bandwidth and reliability for demanding applications.
  • Storage Flexibility: Three 2.5" hot-swap drive bays. Configurable for 2x NVMe + 1x SAS3/SATA3 or 3x SAS3/SATA3 drives, supporting both performance and capacity requirements.
  • RAID Controller: Integrated Broadcom® 3108 controller with 2GB cache, supports RAID levels 0, 1, 5, 6, 10, 50, 60, enabling advanced data protection and performance tuning.
  • Networking: Equipped with 2x SFP+ 10Gb/s ports for high-throughput network connectivity, suitable for bandwidth-intensive workloads.
  • Expansion: No M.2 NVMe slots available.
  • Warranty: Comes with a 36-month manufacturer warranty for hardware support and service continuity.

This blade server is suitable for scalable virtualization, cloud infrastructure, and data-intensive enterprise workloads. The design emphasizes high memory capacity, flexible storage options, and robust network connectivity, making it an ideal choice for modern data centers.

SBI-6119PW-C3N

Data sheet

Socket
LGA3647 (P)
Ilość gniazd procesorów
1
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
205W
Liczba slotów RAM
12
Maksymalna pamięć RAM
3TB 3DS ECC RDIMM/LRDIMM DDR4-2933MHz
Wielkość kieszeni dyskowych
2,5"
Liczba zatok dyskowych
3
Interfejs dysków
2x NVMe + 1x SAS3/SATA3 lub 3x SAS3/SATA3
Złącza internetowe
2x SFP+ 10Gb/s
Liczba złącz M.2 NVMe
0
Dołączone karty rozszerzeń
Kontroler RAID Broadcom® 3108 controller (2GB cache); RAID 0, 1, 5, 6, 10, 50, 60
Gwarancja producenta
36 miesięcy

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