Supermicro SuperBlade SBI-6429P-C3N
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Supermicro SuperBlade SBI-6429P-C3N

SKU: SBI-6429P-C3N
$1,443.72/brutto
$1,173.76/netto
Supermicro SuperBlade SBI-6429P-C3N is a blade server supporting dual LGA3647 (P) sockets for 2nd Gen. Intel® Xeon® Scalable processors (up to 205W TDP), up to 768GB VLP ECC DDR4-2933MHz RDIMM, and three 2.5" hot-swap drive bays with NVMe, SAS3, or SATA3 interfaces. Equipped with Broadcom® 3108 RAID controller, 2x SFP+ 10Gb/s ports, and a 36-month manufacturer warranty.
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Supermicro SuperBlade SBI-6429P-C3N is designed for high-performance and scalable computing environments, offering advanced support for critical enterprise workloads.

  • Processor Support: Dual LGA3647 (P) sockets compatible with 2nd Gen. Intel® Xeon® Scalable processors (not included), supporting up to 205W TDP per CPU.
  • Memory Capacity: 24 DIMM slots accepting up to 768GB of VLP ECC DDR4-2933MHz RDIMM, ensuring robust performance and data integrity for memory-intensive applications.
  • Storage Flexibility: Three 2.5" hot-swap drive bays supporting either 2x NVMe + 1x SAS3/SATA3 or 3x SAS3/SATA3 drives, suitable for various storage configurations and high-speed data access.
  • RAID Controller: Integrated Broadcom® 3108 controller with 2GB cache, supporting RAID 0, 1, 5, 6, 10, 50, and 60 for enhanced data protection and flexibility.
  • Networking: Features 2x SFP+ 10Gb/s network interfaces for high-throughput connectivity in demanding data center environments.
  • Expansion: No M.2 NVMe slots.
  • Warranty: Includes a 36-month manufacturer's warranty for added reliability.

Supermicro SuperBlade SBI-6429P-C3N is engineered for enterprise-scale deployments, providing a balance of compute performance, memory density, and storage versatility in a blade form factor. The system is suitable for data center, virtualization, and HPC workloads requiring high availability and efficient resource utilization.

SBI-6429P-C3N

Data sheet

Socket
LGA3647 (P)
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
205W
Liczba slotów RAM
24
Maksymalna pamięć RAM
768GB VLP ECC DDR4-2933MHz RDIMM
Wielkość kieszeni dyskowych
2,5"
Liczba zatok dyskowych
3
Interfejs dysków
2x NVMe + 1x SAS3/SATA3 lub 3x SAS3/SATA3
Złącza internetowe
2x SFP+ 10Gb/s
Liczba złącz M.2 NVMe
0
Dołączone karty rozszerzeń
Kontroler RAID Broadcom® 3108 controller (2GB cache); RAID 0, 1, 5, 6, 10, 50, 60
Gwarancja producenta
36 miesięcy

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