Supermicro SYS-6029U-TR25M    
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Supermicro SuperServer 2U SYS-6029U-TR25M

SKU: SYS-6029U-TR25M
EAN: 672042281930
$2,759.33/brutto
$2,243.36/netto
Supermicro SuperServer 2U SYS-6029U-TR25M is a high-density server designed for dual LGA 3647 sockets, supporting 1st/2nd Gen. Intel Xeon Scalable CPUs up to 205W TDP. It features 24 DDR4 RAM slots (up to 6TB), 12 hot-swap 3.5" drive bays, redundant 1000W 80 Plus Titanium PSUs, and advanced PCI-E and network connectivity for robust enterprise applications.
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Supermicro SuperServer 2U SYS-6029U-TR25M is engineered for demanding data center and enterprise environments, offering a blend of high-density compute and storage capabilities.

  • Processor Support: Dual LGA 3647 sockets, compatible with 1st/2nd Gen. Intel Xeon Scalable processors, supporting up to 205W TDP per CPU.
  • Memory Capacity: 24 DDR4-2933MHz ECC RDIMM/LRDIMM slots, supporting a maximum of 6TB 3DS memory for intensive workloads and virtualization.
  • Storage Flexibility: Configurable with 12 hot-swap 3.5" drive bays (optional 2.5"), supporting SATA/SAS3 or SAS3 + 4 NVMe drives, providing versatile storage options.
  • PCI-E Expansion: 1x PCI-E 3.0 x16 FH, 7x PCI-E 3.0 x8 (5x FH, 1x LP, 1x internal LP), enabling integration with a wide range of add-on cards.
  • Network Connectivity: Dual SFP28 ports supporting up to 25Gb/s for high-speed data transfer.
  • Power and Redundancy: Equipped with two redundant 1000W 80 Plus Titanium certified power supplies, ensuring high energy efficiency and uninterrupted operation.
  • Additional Interfaces: 3 USB 3.0 ports (2 rear, 1 Type A) facilitate easy peripheral connections.
  • Warranty: Backed by a 36-month manufacturer warranty for reliability.

This server is suitable for applications requiring high compute density, large memory capacity, and flexible storage configurations, including virtualization, database, and cloud infrastructure deployments.

SYS-6029U-TR25M

Data sheet

Socket
LGA 3647
Rodzaj obudowy
2U
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Max. TDP procesora
205W
Liczba slotów RAM
24
Maksymalna pamięć RAM
6TB 3DS ECC RDIMM/LRDIMM DDR4-2933MHz
Zasilacz
1000W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
3,5"
Liczba zatok dyskowych
12
Interfejs dysków
SATA/SAS3 lub SAS3 + 4 NVME
Porty USB
3 USB 3.0 (2 rear, 1 Type A)
Interfejs PCI
1x PCI-E 3.0 x16 FH, 10.5" L 7x PCI-E 3.0 x8 (5x FH, 10.5" L, 1x LP, 1x wewnętrzne LP)
Złącza internetowe
2x SFP28 25Gb/s
Liczba złącz M.2 NVMe
0
Liczba zasilaczy
2
Wydajność energetyczna
80 Plus Titanium
Gwarancja producenta
36 miesięcy

Specific References

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672042281930
ean13
672042281930
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