Supermicro IoT SuperServer SYS-210P-FRDN6T
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  • Supermicro IoT SuperServer SYS-210P-FRDN6T
  • Supermicro IoT SuperServer SYS-210P-FRDN6T

Supermicro IoT SuperServer SYS-210P-FRDN6T

SKU: SYS-210P-FRDN6T
$2,629.84/brutto
$2,138.08/netto
The Supermicro IoT SuperServer SYS-210P-FRDN6T is a 2U rackmount server supporting a single 3rd Gen Intel® Xeon® Scalable processor (LGA 4189), up to 2TB ECC DDR4-3200MHz RAM, dual redundant 600W power supplies, and versatile storage and network options. Designed for reliability and scalability in enterprise IoT deployments.
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Supermicro IoT SuperServer SYS-210P-FRDN6T is engineered for demanding IoT and enterprise environments, providing robust compute and storage capabilities in a compact 2U chassis.

  • Processor Support: Single socket LGA 4189 (P+), compatible with 3rd Gen Intel® Xeon® Scalable CPUs, up to 250W TDP (CPU not included).
  • Memory: Eight DIMM slots supporting up to 2TB ECC DDR4-3200MHz RDIMM/LRDIMM/Intel® DCPMM, enabling high memory bandwidth and reliability.
  • Storage: Two 2.5" hot-swap drive bays, supporting SATA/SAS interfaces, and one M.2 NVMe slot for flexible storage expansion.
  • Power Supply: Dual redundant 600W PSUs ensure operational continuity and minimize downtime.
  • Expansion: Three PCI-E 4.0 FHHL and two PCI-E 4.0 HHHL slots provide extensive options for additional controllers or accelerators.
  • Network Connectivity: Integrated network interfaces include four RJ-45 1 Gb/s and two RJ-45 10 Gb/s ports, delivering high bandwidth and redundancy for network-intensive applications.
  • I/O Ports: Front access to two USB 2.0 and two USB 3.0 ports for fast and convenient peripheral connectivity.
  • Warranty: Backed by a 36-month manufacturer warranty for long-term support.

This server is ideal for scalable IoT, edge computing, and enterprise workloads requiring high availability, performance, and flexible configuration options.

SYS-210P-FRDN6T

Data sheet

Socket
LGA 4189 (P+)
Rodzaj obudowy
2U
Ilość gniazd procesorów
1
Rodzina obsługiwanych procesorów
3rd Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
250W
Liczba slotów RAM
8
Maksymalna pamięć RAM
2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM/Intel® DCPMM
Zasilacz
600W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
2,5"
Liczba zatok dyskowych
2
Liczba mocowań na dyski 2,5"
2
Interfejs dysków
SATA
Porty USB
2 USB 2.0 port(s) (2 front), 2 USB 3.0 port(s) (2 front)
Interfejs PCI
3 PCI-E 4.0 FHHL & 2 HHHL
Złącza internetowe
4x RJ-45 1 Gb/s, 2x RJ-45 10Gb/s
Liczba złącz M.2 NVMe
1
Gwarancja producenta
36 miesięcy

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