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Supermicro CloudDC SuperServer SYS-620C-TN12R

SKU: SYS-620C-TN12R

$3,367.05/brutto

$2,737.44/netto

The Supermicro CloudDC SuperServer SYS-620C-TN12R is a dual-socket 2U rackmount system supporting 3rd Gen Intel® Xeon® Scalable processors (LGA 4189), up to 6TB ECC DDR4-3200MHz RAM, and twelve hot-swap 3.5" bays with NVMe, SATA, or SAS interfaces. It offers redundant 1200W power supplies and multiple PCI-E 4.0 expansion options.

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Description
Product Details

Supermicro CloudDC SuperServer SYS-620C-TN12R is a high-performance 2U rackmount server designed for demanding data center and cloud environments. Built for scalability and reliability, it accommodates dual LGA 4189 (P+) sockets for 3rd Gen Intel® Xeon® Scalable processors, supporting a maximum processor TDP of 270W each.

Processor Support: Dual LGA 4189 sockets, compatible with 3rd Gen Intel® Xeon® Scalable CPUs (processors not included).
Memory Capacity: Sixteen DIMM slots supporting up to 6TB of 3DS ECC DDR4-3200MHz LRDIMM or RDIMM memory.
Storage Flexibility: Twelve hot-swap drive bays for 3.5" drives (optionally 2.5"), supporting NVMe, SATA, or SAS interfaces. Includes two M.2 NVMe slots for fast local storage or boot drives.
Expandability: Multiple PCI Express 4.0 slots: 4 x16 FHHL, or 2 x16 FHHL and 4 x8 FHHL; plus 2 x16 AIOM (OCP 3.0) slots for advanced networking or expansion modules.
Power & Redundancy: Equipped with 1200W redundant power supplies for high availability and uptime.
Connectivity: Two rear USB 3.0 ports; network connectivity enabled via AIOM card (not included).
Warranty: Manufacturer warranty of 36 months.

This server platform provides robust performance, high memory capacity, and flexible storage options, making it suitable for virtualization, cloud applications, and enterprise workloads. Its redundant power and hot-swap capabilities ensure operational continuity and ease of maintenance.

Reference SYS-620C-TN12R

Data sheet

Socket: LGA 4189 (P+)
Rodzaj obudowy: 2U
Ilość gniazd procesorów: 2
Rodzina obsługiwanych procesorów: 3rd Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę: Nie
Max. TDP procesora: 270 W
Liczba slotów RAM: 16
Maksymalna pamięć RAM: 6TB 3DS ECC DDR4-3200MHz LRDIMM/RDIMM/
Zasilacz: 1200W
Zasilacz redundantny: Tak
Wielkość kieszeni dyskowych: 3,5"
Liczba zatok dyskowych: 12
Interfejs dysków: NVMe/SATA/SAS
Porty USB: 2 USB 3.0 ports (rear)
Interfejs PCI: 4 PCI-E 4.0 x16 FHHL (OR) 2 PCI-E 4.0 x16 FHHL and 4 PCI-E 4.0 x8 FHHL; 2 PCI-E 4.0 x16 AIOM (OCP 3.0);
Złącza internetowe: Możliwość zamontowania poprzez kartę AIOM
Liczba złącz M.2 NVMe: 2
Gwarancja producenta: 36 miesięcy