Supermicro UP SuperServer SYS-510P-WT
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  • Supermicro UP SuperServer SYS-510P-WT
  • Supermicro UP SuperServer SYS-510P-WT

Supermicro UP SuperServer SYS-510P-WT

SKU: SYS-510P-WT
$1,610.41/brutto
$1,309.28/netto
The Supermicro UP SuperServer SYS-510P-WT is a 1U rackmount server supporting single-socket LGA 4189 (P+) for 3rd Gen Intel Xeon Scalable CPUs, up to 3TB DDR4 RAM, multiple storage options including hot-swap bays, and a 600W power supply. Ideal for enterprise workloads requiring high memory capacity and flexible connectivity.
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Supermicro UP SuperServer SYS-510P-WT is engineered for demanding enterprise applications that require scalability and flexibility in a compact 1U form factor. Designed with advanced hardware compatibility, this system is suitable for data centers and business-critical environments.

  • Processor Support: Compatible with single-socket LGA 4189 (P+) and supports 3rd Gen Intel® Xeon® Scalable processors (up to 270W TDP; processor not included).
  • Memory Capacity: Up to 3TB DDR4-3200MHz (3DS RDIMM, LRDIMM, Intel® DCPMM), with 8 DIMM slots for high-performance workloads.
  • Storage Flexibility: Four 3.5" hot-swap drive bays, supporting SATA, NVMe, and SAS interfaces, plus one M.2 NVMe slot for additional high-speed storage.
  • Expansion & Connectivity: Three PCI-E 4.0 x16 slots (2 FHFL, 1 LP), extensive USB options including USB 3.2 Gen 1 and USB 2.0 ports, and dual 10Gb/s RJ-45 network interfaces ensure versatile connectivity.
  • Power Supply: Equipped with a 600W power supply (non-redundant), suitable for high-efficiency operation in rack environments.
  • Reliability: Backed by a 36-month manufacturer warranty for peace of mind in mission-critical deployments.

This server is ideal for applications such as virtualization, database hosting, and enterprise storage, offering robust memory and I/O capabilities in a space-efficient chassis.

SYS-510P-WT

Data sheet

Socket
LGA 4189 (P+)
Rodzaj obudowy
1U
Ilość gniazd procesorów
1
Rodzina obsługiwanych procesorów
3rd Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
270 W
Liczba slotów RAM
8
Maksymalna pamięć RAM
3TB 3DS DDR4-3200MHz RDIMM/LRDIMM/Intel® DCPMM
Zasilacz
600W
Zasilacz redundantny
Nie
Wielkość kieszeni dyskowych
3.5
Liczba zatok dyskowych
4
Interfejs dysków
SATA/NVMe/SAS
Porty USB
3 USB port(s) (2 headers; 1 Type A), 4 USB 3.2 Gen 1 port(s) (2 headers; 2 rear), 2 USB 2.0 port(s) (2 rear)
Interfejs PCI
Slot 1: PCI-E 4.0 x16 FHFL, Slot 2: PCI-E 4.0 x16 FHFL, Slot 3: PCI-E 4.0 x16 LP
Złącza internetowe
2
Liczba złącz M.2 NVMe
1
Gwarancja producenta
36 miesięcy

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