Supermicro SuperServer 6019P-WT8
zoom_in
  • Obecnie brak na stanie
  • Supermicro SuperServer 6019P-WT8
  • Supermicro SuperServer 6019P-WT8

Supermicro SuperServer SYS-6019P-WT8

SKU: SYS-6019P-WT8
$1,704.09/brutto
$1,385.44/netto
The Supermicro SuperServer SYS-6019P-WT8 is a 1U rackmount server supporting dual LGA 3647 sockets for 2nd Gen. Intel® Xeon® Scalable processors, up to 3TB ECC DDR4-2933MHz RAM, and eight 3.5" hot-swap drive bays. It features robust PCI-E expansion, redundant power capability, and enterprise-class connectivity, making it suitable for demanding data center applications.
Quantity
block Obecnie brak na stanie

help_outlineAsk about product

I accept privacy policy rules  

Supermicro SuperServer SYS-6019P-WT8 is engineered for high-density datacenter and enterprise workloads. Designed in a compact 1U rackmount form factor, it supports dual LGA 3647 sockets for 2nd Gen. Intel® Xeon® Scalable processors (up to 165W TDP per CPU).

  • Memory: 12 DIMM slots, accommodating up to 3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, with support for Intel® Optane™ DCPMM.
  • Drive Bays: 8x 3.5" hot-swap SATA/SAS bays and 2 additional 2.5" SSD mounts, offering flexibility for primary and secondary storage needs.
  • Expansion: 2 PCI-E 3.0 x16 (FHHL), 1 PCI-E 3.0 x8 (LP), and 1 PCI-E 3.0 x16 slot for Add-on-Modules, ensuring ample support for networking and storage controllers.
  • Connectivity: 2 RJ-45 1Gb/s Ethernet ports and 4 rear USB 3.0 ports facilitate integration into modern IT environments.
  • Storage Interface: Native support for SATA/SAS drives; 1x M.2 NVMe slot for high-speed SSDs.
  • Power: Equipped with a 650W power supply (non-redundant) to support high-performance configurations.
  • Warranty: Backed by a 36-month manufacturer warranty for reliable operation.

The SuperServer SYS-6019P-WT8 is suitable for virtualization, cloud, high-performance computing, and enterprise storage solutions, combining robust hardware support with efficient space utilization.

SYS-6019P-WT8

Data sheet

Socket
LGA 3647
Rodzaj obudowy
1U
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
165W
Liczba slotów RAM
12
Maksymalna pamięć RAM
3TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM
Zasilacz
650W
Zasilacz redundantny
Nie
Wielkość kieszeni dyskowych
3.5
Liczba zatok dyskowych
8
Liczba mocowań na dyski 2,5"
2
Interfejs dysków
SATA
Porty USB
4 USB 3.0 ports (Rear)
Interfejs PCI
2 PCI-E 3.0 x16 (FHHL) slots; 1 PCI-E 3.0 x8 (LP) slot; 1 PCI-E 3.0 x16 for Add-on-Module (AOM)
Złącza internetowe
1
Liczba złącz M.2 NVMe
1
Gwarancja producenta
36 miesięcy

Specific References

New

16 other products in the category

Comments (0)
No customer reviews for the moment.