Supermicro MBD-X11DPH-I Motherboard

The Supermicro MBD-X11DPH-I is a high-density, dual-socket E-ATX motherboard designed for advanced server and workstation environments requiring high memory capacity, robust I/O and reliable 24/7 operation. It supports 1st and 2nd Gen Intel® Xeon® Scalable processors in LGA 3647 with CPU TDP up to 205W, enabling scalable compute performance for virtualization, data processing and technical workloads.

With 16 DIMM slots and support for up to 4TB 3DS ECC DDR4-2933 RDIMM/LRDIMM memory, this platform is optimized for memory-intensive applications where data integrity and stability are critical.

• Processor support: Dual LGA 3647 sockets for 1st/2nd Gen Intel® Xeon® Scalable CPUs (no processors included; max TDP 205W per CPU)
• Form factor: E-ATX, suitable for compatible server and workstation chassis
• Memory subsystem: 16 DIMM slots, up to 4TB 3DS ECC DDR4-2933 RDIMM/LRDIMM for high-capacity, error-correcting memory configurations
• Expansion slots: 3x PCI Express 3.0 x16 and 4x PCI Express 3.0 x8 for add-in cards such as GPUs, storage controllers or network adapters
• Storage connectivity: 2x M.2 NVMe slots for high-speed solid-state storage (ideal for OS, cache or low-latency data access)
• Network interfaces: 2x RJ-45 Gigabit Ethernet (1Gb/s) for redundant or segmented network configurations
• USB connectivity: 7x USB 3.0 ports (4 rear, 2 front-panel headers, 1 internal Type-A) for high-speed peripheral and service access
• Reliability: ECC memory support and a 36-month manufacturer warranty for long-term, mission-critical deployments

The MBD-X11DPH-I delivers a balanced platform for compute, memory and I/O scalability. Its extensive PCIe layout and dual M.2 NVMe support allow flexible configuration of storage and accelerator cards, while dual 1GbE ports provide straightforward network integration. This board is intended for users who require a technically robust base for server or workstation builds and who will select compatible chassis, power and cooling solutions according to their specific deployment scenario.