Intel Haswell-EP Xeon DP MicroBlade 10G w/Single Package is a server-class compute module designed for dense, dual-processor (DP) blade infrastructures. Optimized for 10G connectivity and modular deployment, it enables scalable, high‑density compute nodes in MicroBlade environments, supporting virtualized workloads, cloud services and technical applications in space‑constrained data centers.
Intel Haswell-EP Xeon DP MicroBlade 10G w/Single Package is a dedicated compute element for high-density blade infrastructures. It is intended for dual-processor (DP) server platforms based on Intel Haswell-EP Xeon technology and 10G networking in MicroBlade environments.
The module is suited to applications where space efficiency, modularity and predictable performance are critical. It can be used as a building block for scalable compute clusters, allowing administrators to increase capacity by adding additional MicroBlade units as needed.
High-density architecture – designed for blade chassis deployments, enabling multiple compute nodes in a compact footprint and improving rack utilization in data centers.
10G-oriented connectivity – prepared for integration in infrastructures using 10 Gigabit networking, supporting high-throughput data paths between compute nodes and storage or core switches.
Dual-processor (DP) platform readiness – intended for configurations based on Intel Xeon Haswell-EP DP processors, allowing balanced multi-core performance for virtualized and multi-threaded workloads.
MicroBlade ecosystem integration – fits MicroBlade-style modular systems, simplifying deployment, maintenance and scaling through standardized, hot-pluggable compute modules (actual hot-plug capabilities depend on the target chassis specification).
Usage scenarios
Virtualization and private cloud – suitable as a compute node in environments running multiple virtual machines or containers, where density and network throughput are essential.
Web and application hosting – can serve as a front-end or application tier node in horizontally scaled architectures.
Technical and development environments – appropriate for build farms, test clusters and lab infrastructures that require modular expansion.
Operational benefits
Scalable capacity – capacity can be increased by adding more MicroBlade modules without major changes to the rack layout.
Modular serviceability – the single-package design supports straightforward replacement or reallocation of compute resources within the chassis.
Infrastructure optimization – consolidates multiple servers into a blade chassis, helping reduce cabling complexity and simplifying physical infrastructure management.
Specific processor models, memory configuration, storage options and exact 10G interface types are dependent on the final system configuration and the compatible MicroBlade chassis. For precise technical parameters, refer to the detailed specification of the target chassis and the selected Intel Haswell-EP Xeon DP processors.
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Intel Haswell-EP Xeon DP MicroBlade 10G w/Single Package is a server-class compute module designed for dense, dual-processor (DP) blade infrastructures. Optimized for 10G connectivity and modular deployment, it enables scalable, high‑density compute nodes in MicroBlade environments, supporting virtualized workloads, cloud services and technical applications in space‑constrained data centers.