Supermicro Mainstream SuperServer SYS-740P-TR
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  • Supermicro Mainstream SuperServer SYS-740P-TR
  • Supermicro Mainstream SuperServer SYS-740P-TR

Supermicro Mainstream SuperServer SYS-740P-TR

SKU: SYS-740P-TR
$2,413.56/brutto
$1,962.24/netto
The Supermicro SYS-740P-TR is a 4U rackmount server supporting dual LGA 4189 (P+) sockets for 3rd Gen Intel® Xeon® Scalable processors (max 270W TDP). It offers 16 DIMM slots for up to 4TB DDR4 ECC RDIMM memory, 8 hot-swap 3.5" drive bays, 2.5" drive mounts, redundant 1200W power, and robust expansion with PCI-E 4.0 and M.2 NVMe connectivity.
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Supermicro Mainstream SuperServer SYS-740P-TR is engineered for high-performance computing environments requiring scalability, reliability, and flexibility. This 4U server chassis supports a wide array of enterprise applications.

  • Processor Support: Dual LGA 4189 (P+) sockets, compatible with 3rd Gen Intel® Xeon® Scalable processors (up to 270W TDP; CPUs not included).
  • Memory Capacity: 16 DIMM slots, up to 4TB 3DS ECC RDIMM DDR4-3200MHz, enabling large in-memory computing tasks with error correction for reliability.
  • Storage: 8 hot-swap 3.5" drive bays for SATA/SAS drives, 2 additional 2.5" drive mounts, and 1x M.2 NVMe slot, supporting flexible storage configurations.
  • Expansion: 4 PCI-E 4.0 x16 FH and 2 PCI-E 4.0 x8 FH slots allow integration of high-speed add-in cards for networking, storage, or GPU acceleration.
  • Connectivity: 2x RJ-45 (1Gb/s), 2 front USB 2.0 ports, 4 rear USB 3.0 ports for versatile external device support.
  • Power & Reliability: Redundant 1200W power supply ensures system uptime and operational continuity in critical environments.
  • Warranty: 36-month manufacturer warranty for extended support.

This platform is suitable for data centers, virtualization, or compute-intensive workloads where expandability and uptime are essential.

SYS-740P-TR

Data sheet

Socket
LGA 4189 (P+)
Rodzaj obudowy
4U
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
3rd Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
270 W
Liczba slotów RAM
16
Maksymalna pamięć RAM
4TB 3DS ECC RDIMM, DDR4-3200MHz
Zasilacz
1200W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
3.5
Liczba zatok dyskowych
8
Liczba mocowań na dyski 2,5"
2
Interfejs dysków
SATA
Porty USB
2 USB 2.0 port(s) (2 front), 4 USB 3.0 port(s) (4 rear)
Interfejs PCI
4 PCI-E 4.0 x16 Full Height (FH), 2 PCI-E 4.0 x8 Full Height (FH)
Złącza internetowe
1
Liczba złącz M.2 NVMe
1
Gwarancja producenta
36 miesięcy

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