Supermicro IoT SuperServer SYS-110P-FWTR
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  • Supermicro IoT SuperServer SYS-110P-FWTR
  • Supermicro IoT SuperServer SYS-110P-FWTR

Supermicro IoT SuperServer SYS-110P-FWTR

SKU: SYS-110P-FWTR
$1,968.59/brutto
$1,600.48/netto
The Supermicro IoT SuperServer SYS-110P-FWTR is a 1U rackmount server designed for high-performance applications. Featuring support for a single 3rd Gen Intel® Xeon® Scalable processor (Socket LGA 4189), up to 2TB ECC DDR4-3200 RAM, redundant 800W power supplies, and versatile storage and expansion options, it is ideal for demanding IoT and enterprise environments.
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Supermicro IoT SuperServer SYS-110P-FWTR is a high-density 1U rackmount system engineered for IoT and data center deployments requiring robust performance and reliability. It is equipped with advanced features to support a wide range of applications.

  • Processor Support: Single socket LGA 4189 (P+) for 3rd Gen Intel® Xeon® Scalable CPUs, up to 205W TDP (processor not included).
  • Memory Capacity: 8 DIMM slots supporting up to 2TB 3DS ECC DDR4-3200 RDIMM/LRDIMM, ensuring high memory bandwidth and reliability.
  • Form Factor: Compact 1U chassis; motherboard size 8" x 13" (20.32cm x 33.02cm).
  • Power Supply: 800W redundant PSU for enhanced uptime and operational security.
  • Storage: 2x 2.5" drive bays (SATA3 interface) and 1x M.2 NVMe slot for flexible storage configurations.
  • Expansion: PCIe 4.0 support with 1x PCIe 4.0 x16LP and 2x PCIe 4.0 x16 FHFL slots, enabling integration of high-speed network cards or accelerators.
  • Network Connectivity: Dual 10Gb/s RJ-45 Ethernet ports for high-throughput data transfer.
  • USB Ports: 2x USB 3.0 and 2x USB 2.0 (front panel) for convenient device connectivity.
  • Warranty: 36-month manufacturer warranty.

This server is designed to deliver robust performance, scalability, and reliability for IoT, virtualization, and enterprise workloads, offering flexible expansion and high memory capacities to meet demanding operational needs.

SYS-110P-FWTR

Data sheet

Socket
LGA 4189 (P+)
Rodzaj obudowy
1U
Rozmiar płyty:
8" x 13" (20.32cm x 33.02cm)
Ilość gniazd procesorów
1
Rodzina obsługiwanych procesorów
3rd Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
205W
Liczba slotów RAM
8
Maksymalna pamięć RAM
2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM
Zasilacz
800W
Zasilacz redundantny
Tak
Liczba mocowań na dyski 2,5"
2
Interfejs dysków
SATA3
Porty USB
2x USB 3.0 (front) 2x USB 2.0 (front)
Interfejs PCI
1x PCIe 4.0 x16LP, 2x PCIe 4.0 x16 FHFL
Złącza internetowe
2
Liczba złącz M.2 NVMe
1
Gwarancja producenta
36 miesięcy

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