Supermicro CloudDC SuperServer SYS-610C-TR
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  • Supermicro CloudDC SuperServer SYS-610C-TR
  • Supermicro CloudDC SuperServer SYS-610C-TR

Supermicro CloudDC SuperServer SYS-610C-TR

SKU: SYS-610C-TR
$2,598.93/brutto
$2,112.95/netto
The Supermicro CloudDC SuperServer SYS-610C-TR is a 1U rackmount server supporting dual LGA 4189 (P+) sockets for 3rd Gen Intel® Xeon® Scalable processors. It features 16 memory slots for up to 6TB ECC DDR4-3200 RAM, redundant 860W power supplies, 4 hot-swap 2.5" drive bays, dual PCI-E 4.0 x16 slots, and two M.2 NVMe connectors. Network interfaces are available via AIOM card installation.
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Supermicro CloudDC SuperServer SYS-610C-TR is designed for high-density data center and cloud environments that require reliability, scalability, and robust performance.

  • Processor Support: Dual LGA 4189 (P+) sockets, compatible with 3rd Gen Intel® Xeon® Scalable processors (up to 270W TDP per CPU).
  • Memory: 16 DIMM slots, supporting a maximum of 6TB 3DS ECC DDR4-3200 RAM (LRDIMM/RDIMM/Intel® DCPMM).
  • Chassis: 1U form factor suitable for standard rack installations.
  • Storage: 4 hot-swap 2.5" drive bays (SATA/SAS interface), and 2 M.2 NVMe slots for fast storage expansion.
  • Expansion: 2 PCI-E 4.0 x16 FHHL slots for additional cards and upgrades.
  • Connectivity: 2 rear USB 3.0 ports; networking available via AIOM network card (not included).
  • Power Supply: 860W redundant power for enhanced uptime and reliability.
  • Warranty: 36 months manufacturer warranty.

This SuperServer is optimized for enterprise applications, virtualization, and cloud computing. The hot-swap drive bays and redundant power supplies facilitate maintenance and minimize downtime, making it a dependable solution for mission-critical workloads. The support for up to 6TB RAM and high-performance PCI-E 4.0 expansion slots provide flexibility for intensive computing tasks.

SYS-610C-TR

Data sheet

Socket
LGA 4189 (P+)
Rodzaj obudowy
1U
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
3rd Gen Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
270 W
Liczba slotów RAM
16
Maksymalna pamięć RAM
6TB 3DS ECC DDR4-3200: LRDIMM/RDIMM/Intel® DCPMM
Zasilacz
860W
Zasilacz redundantny
Tak
Wielkość kieszeni dyskowych
2,5"
Liczba zatok dyskowych
4
Interfejs dysków
SATA
Porty USB
2 USB 3.0 port(s) (2 rear)
Interfejs PCI
Slot 1: PCI-E 4.0 x16 FHHL; Slot 2: PCI-E 4.0 x16 FHHL
Złącza internetowe
Możliwość zamontowania poprzez kartę AIOM
Liczba złącz M.2 NVMe
2
Gwarancja producenta
36 miesięcy

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