Supermicro MBD-X11SWN-E Motherboard with Intel® Core™ i5-8365UE

The Supermicro MBD-X11SWN-E is a compact 3.5" single board computer (SBC) designed for embedded, industrial and edge computing environments that require high reliability, low power consumption and extended lifecycle availability. The board integrates an Intel® Core™ 8th Gen i5-8365UE processor and supports high-capacity DDR4 memory for demanding multi-threaded workloads.

Zintegrowany procesor

• Socket: FCBGA-1528, single-CPU design
• Integrated CPU: Intel® Core™ 8th Gen i5-8365UE
• 4 cores / 8 threads, base frequency 1.6 GHz
• 6 MB Intel Smart Cache
• Max. CPU TDP: 15 W – optimized for low-power, fan-efficient systems

Pamięć operacyjna

• Number of RAM slots: 2 x SO-DIMM
• Supported memory type: DDR4-2400 MHz
• Maximum memory capacity: up to 64 GB
• High memory density for virtualization, containerization and parallel data processing on a small footprint

Magazyn danych i rozszerzenia

• 2 x M.2 NVMe slots – high-speed PCIe storage for OS and data
• Support for compact SSD-based designs without moving parts
• Suitable for applications requiring fast random I/O and low latency

Łączność sieciowa i I/O

• 2 x RJ-45 1 Gb/s Ethernet ports – redundant or segmented networking
• 4 x USB 3.1 Gen2 (rear) – high-bandwidth peripherals and external storage
• 4 x USB 2.0 via headers – internal modules, legacy or low-speed devices
• Balanced I/O mix for industrial controllers, gateways and edge appliances

Format i zastosowania

• Form factor: 3.5" SBC – compact footprint for embedded chassis and custom enclosures
• Single-board design simplifies integration and reduces cabling complexity
• Suitable for edge computing, industrial automation, IoT gateways, digital signage and embedded control systems requiring continuous 24/7 operation

Niezawodność i wsparcie

• Manufacturer warranty: 36 months
• Designed for stable, long-term deployments in professional environments

The Supermicro MBD-X11SWN-E offers a balanced combination of multi-core CPU performance, low power envelope and rich connectivity in a 3.5" SBC format, enabling robust and scalable embedded solutions.