Supermicro MBD-X11SPA-T-O Motherboard LGA3647 E-ATX, 3TB DDR4, 10GbE, 4x M.2 NVMe
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  • Supermicro MBD-X11SPA-T-O Motherboard LGA3647 E-ATX, 3TB DDR4, 10GbE, 4x M.2 NVMe

Supermicro MBD-X11SPA-T-O Motherboard

SKU: MBD-X11SPA-T-O
EAN: 672042365661
$763.20/brutto
$620.49/netto
Server-grade E-ATX motherboard for 1st/2nd Gen Intel Xeon Scalable (LGA3647), supporting up to 3TB DDR4-2933 ECC RDIMM/LRDIMM across 12 DIMM slots. Features 4x M.2 NVMe, flexible PCIe 3.0 x16/x8 layout, mixed 1GbE + 10GbE LAN, and extensive USB 3.1 Gen1/Gen2 connectivity. Designed for high-TDP CPUs up to 205W and 24/7 professional workloads.
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Supermicro MBD-X11SPA-T-O is a server/workstation-class E-ATX motherboard designed for single-socket 1st and 2nd Gen Intel Xeon Scalable processors in LGA 3647. It combines high memory capacity, extensive PCIe expansion and fast storage options for demanding professional applications.

Processor and power support

  • Socket: LGA 3647 for 1st/2nd Gen Intel Xeon Scalable CPUs
  • CPU sockets: Single-socket configuration
  • Maximum supported CPU TDP: 205 W
  • Processor included: No CPU in the box – requires separate purchase

Memory subsystem

  • DIMM slots: 12 for high-density configurations
  • Maximum memory capacity: up to 3 TB
  • Supported memory types: 3DS ECC RDIMM/LRDIMM DDR4-2933 MHz
  • ECC support for improved reliability and data integrity in critical workloads

Expansion and PCI Express

  • PCIe slots: 4 × PCI-E 3.0 x16, 3 × PCI-E 3.0 x8 (mechanical x16)
  • Configurable lane distribution modes:
  • Mode 1: x16 / NA / x16 / NA / x16 / NA / x16
  • Mode 2: x16 / x8 / x8 / x8 / x8 / x8 / x8
  • Suitable for multi-GPU, high-speed I/O, or advanced accelerator cards depending on configuration

Storage and M.2 NVMe

  • M.2 NVMe slots: 4 on-board
  • Enables high-throughput, low-latency SSD arrays for intensive workloads

Networking

  • LAN ports:
  • 1 × RJ-45 1 Gb/s Ethernet
  • 1 × RJ-45 10 Gb/s Ethernet
  • Provides flexible network topology options, from standard connectivity to high-bandwidth links

USB connectivity

  • 6 × USB 3.1 Gen1 (4 × rear Type-A, 2 × via headers)
  • 4 × USB 3.1 Gen2 (2 × rear: Type-A + Type-C; 1 × internal Type-A; 1 × internal Type-C)
  • 2 × USB 2.0 via internal headers
  • Supports modern peripherals, high-speed external storage and service ports

Form factor and reliability

  • Form factor: E-ATX – requires compatible chassis
  • Designed for continuous, professional operation in server and workstation environments
  • Manufacturer warranty: 36 months

This platform targets users who require high memory capacity, robust PCIe expansion and integrated 10 GbE networking for virtualization, content creation, CAD/CAE, or data-intensive workloads.

MBD-X11SPA-T-O

Data sheet

Socket
LGA 3647
Rozmiar płyty:
E-ATX
Ilość gniazd procesorów
1
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
205W
Liczba slotów RAM
12
Maksymalna pamięć RAM
3TB 3DS ECC RDIMM/LRDIMM DDR4-2933MHz
Porty USB
6 USB 3.1 Gen1(4 Rears Type A 2 headers); 4 USB 3.1 Gen2 (2 Rear (Type A + Type C); 1 Type A; 1 Type C) 2 USB 2.0(2 headers)
Interfejs PCI
4 PCI-E 3.0 x16; 3 PCI-E 3.0 x8 (slot x16)
Złącza internetowe
1 RJ-45 1Gb/s; 1 RJ-45 10Gb/s
Liczba złącz M.2 NVMe
4
Gwarancja producenta
36 miesięcy

Specific References

upc
672042365661
ean13
672042365661
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