Supermicro MBD-X11DPH-TQ Motherboard | Dual LGA3647, 4TB DDR4, 10GbE
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  • Supermicro MBD-X11DPH-TQ Motherboard | Dual LGA3647, 4TB DDR4, 10GbE

Supermicro MBD-X11DPH-TQ Motherboard

SKU: MBD-X11DPH-TQ-O
EAN: 672042291724
$1,287.48/brutto
$1,046.73/netto
High‑performance E-ATX server motherboard with dual LGA3647 sockets for 1st/2nd Gen Intel® Xeon® Scalable CPUs (up to 205W), 16 DIMM slots for up to 4TB ECC DDR4-2933 RDIMM/LRDIMM, dual 10GbE LAN, 6x PCIe 3.0 expansion slots, 2x M.2 NVMe and 7x USB 3.0 ports.
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The Supermicro MBD-X11DPH-TQ is a high-density E-ATX server motherboard designed for compute‑intensive, memory‑bound and virtualization workloads. It supports dual LGA3647 sockets and is optimized for 1st and 2nd Gen Intel® Xeon® Scalable processors with TDP up to 205W, enabling robust multi-core configurations in demanding data center and enterprise environments.

With 16 DIMM slots and support for up to 4TB of 3DS ECC DDR4-2933 RDIMM/LRDIMM memory, this platform delivers high memory capacity and reliability for applications such as virtualization clusters, in-memory databases, and advanced analytics.

  • CPU support: Dual LGA 3647 sockets for 1st/2nd Gen Intel® Xeon® Scalable processors (no CPU included; max TDP 205W per socket).
  • Memory architecture: 16 DIMM slots supporting up to 4TB 3DS ECC DDR4-2933 RDIMM/LRDIMM for high-capacity, error-correcting memory configurations.
  • Form factor: E-ATX, suitable for compatible server and workstation chassis requiring extended board layouts.
  • PCIe expansion: 3x PCI Express 3.0 x16 and 3x PCI Express 3.0 x8 slots to integrate high-speed NICs, HBAs, RAID controllers or GPU/accelerator cards, depending on system design.
  • Storage flexibility: 2x M.2 NVMe slots enabling high-throughput, low-latency SSDs for OS, cache or performance-critical data sets.
  • Network connectivity: 2x RJ-45 10Gb/s Ethernet ports for high-bandwidth server and storage networking, suitable for virtualized and clustered environments.
  • USB connectivity: 7x USB 3.0 ports (4 rear, 2 front, 1 Type A) for high-speed peripheral and service device connections.
  • Reliability: ECC memory support and a 36‑month manufacturer warranty for stable, long-term deployment in professional infrastructures.

This board is targeted at system integrators and IT professionals building scalable servers or workstations that require high memory capacity, strong I/O expansion capabilities and integrated 10GbE connectivity. The combination of dual-socket compute, extensive RAM support and versatile PCIe layout makes it suitable for a wide range of professional applications where consistent performance and reliability are critical.

MBD-X11DPH-TQ-O

Data sheet

Socket
LGA 3647
Rozmiar płyty:
E-ATX
Ilość gniazd procesorów
2
Rodzina obsługiwanych procesorów
2nd Gen. Intel® Xeon® Scalable
Procesor wbudowany w płytę
Nie
Max. TDP procesora
205W
Liczba slotów RAM
16
Maksymalna pamięć RAM
4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Porty USB
7 USB 3.0 (4 rear, 2 front, 1 Type A)
Interfejs PCI
3 PCI-E 3.0 x16; 3 PCI-E 3.0 x8
Złącza internetowe
2
Liczba złącz M.2 NVMe
2
Gwarancja producenta
36 miesięcy

Specific References

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672042291724
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672042291724
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