Supermicro SNK-P0068PSC 2U

Supermicro SNK-P0068PSC 2U is a passive CPU heatsink engineered for high-density server environments using LGA3647 (P) processors. Designed for 2U chassis, it relies on system airflow to dissipate heat efficiently while maintaining silent operation.

Key technical parameters

• Form factor: Compatible with 2U server chassis (minimum chassis height 2U)
• Cooling type: Passive heatsink, no integrated fan
• Supported CPU socket: LGA3647 (P)
• Maximum CPU power (TDP): up to 205 W

Technical advantages

• Optimized for 2U airflow: Designed to work with front-to-back airflow in rack servers, supporting stable operating temperatures under continuous load.
• Passive, noise-free design: No moving parts in the heatsink itself, relying on chassis fans for cooling, which can simplify maintenance and reduce acoustic noise at the component level.
• Support for high TDP CPUs: Thermal design tailored for processors up to 205 W, suitable for compute-intensive workloads when used in a properly cooled 2U chassis.
• Targeted for enterprise servers: Intended for professional deployments such as virtualization hosts, HPC nodes, storage controllers and other data center applications using LGA3647 (P) platforms.

Deployment considerations

• Requires a compatible LGA3647 (P) motherboard and 2U server chassis.
• Thermal performance depends on the server's system fan configuration and overall airflow design.
• Suitable where low component complexity and predictable, chassis-driven cooling are preferred over active CPU coolers.

This heatsink is intended for integrators and IT professionals building or upgrading 2U rack servers based on LGA3647 (P) processors, where controlled data center airflow is available to ensure reliable passive cooling.