Supermicro SNK-P0062P 1U

Supermicro SNK-P0062P 1U is a passive CPU heatsink engineered for 1U rackmount server platforms using SP3 socket processors. It is designed to work in conjunction with the chassis airflow to provide stable, long-term cooling performance for CPUs up to 180 W TDP.

The passive construction eliminates moving parts at the heatsink level, reducing potential points of failure and simplifying thermal management in dense server environments. This solution is particularly suitable for data centers, virtualization hosts and HPC nodes where predictable thermal behavior and high availability are critical.

• Form factor: optimized for 1U enclosures, enabling high-density rack deployments.
• Cooling type: passive heatsink relying on system-level airflow for heat dissipation.
• Supported CPU socket: SP3.
• Maximum CPU power: up to 180 W TDP (according to provided specification).
• Manufacturer warranty: 36 months.

Technical and operational benefits

• High thermal headroom: support for CPUs up to 180 W TDP helps maintain stable operating temperatures in demanding workloads, assuming appropriate chassis airflow.
• Reliability: passive design means no fans integrated in the heatsink, eliminating wear-prone mechanical components at this level.
• Serviceability: standard SP3 mounting compatibility (as per given data) simplifies integration and replacement within supported platforms.
• Data center ready: form factor tailored to 1U servers supports space-efficient rack configurations and consistent cooling design across nodes.

When deploying the Supermicro SNK-P0062P 1U, ensure that the server chassis provides adequate front-to-back airflow and that the overall thermal design of the system is aligned with the CPU TDP and workload characteristics.