Supermicro SNK-P0058PSU 2U

Supermicro SNK-P0058PSU 2U is a passive CPU heatsink engineered for use in 2U server platforms based on the LGA2011 socket. It is designed for environments where predictable, controlled airflow is provided by the chassis, enabling efficient, fanless CPU cooling.

The cooler supports processors with a maximum thermal design power (TDP) of up to 160 W, making it suitable for a wide range of server-class CPUs used in compute-intensive workloads, virtualized infrastructures and storage systems.

• Form factor compatibility: minimum chassis height 2U – dedicated for rack-mounted servers with guided airflow.
• Cooling type: passive – no integrated fan, relies on system fans and airflow design of the server chassis.
• Supported CPU sockets: LGA2011 – compatible with platforms using this server socket standard.
• Max CPU power: up to 160 W TDP – suitable for high-performance processors within this thermal envelope.
• Warranty: 36 months manufacturer warranty for long-term operational reliability.

By eliminating moving parts in the cooling element itself, the SNK-P0058PSU reduces mechanical wear and potential points of failure. This is particularly relevant in data centers and enterprise installations where continuous 24/7 operation and predictable maintenance windows are critical.

The passive design also simplifies thermal management at the system level: the heatsink is integrated into the overall airflow concept of the 2U chassis, allowing administrators to control cooling performance via chassis fan profiles rather than per-cooler fans.

Key benefits in server environments:

• Optimized for 2U rack servers with LGA2011 platforms.
• Supports CPUs up to 160 W TDP, suitable for demanding workloads.
• Passive operation – no additional fan control or fan cabling required.
• Reduced risk of mechanical failure due to absence of moving parts in the cooler.
• 36-month warranty supports long-life deployment cycles.

This cooler is intended for use in properly ventilated server chassis and should be combined with adequate system airflow according to the server vendor's thermal guidelines.