BPN-SAS2-216EL2

BPN-SAS2-216EL2 is a professional-grade storage backplane module engineered for integration in server and storage systems that require stable, high-density drive connectivity. It is suitable for data centers, enterprise IT, and other environments where robust and organized storage infrastructure is essential.

Designed as a dedicated backplane component, this unit provides a structured connection interface between drives and host controllers, helping to simplify cabling and improve serviceability in complex storage setups.

• Enterprise-oriented design – intended for use in professional rack servers or storage enclosures, where consistent performance and predictable behavior are critical.
• Backplane-based connectivity – enables centralized connection of multiple drives to host controllers, reducing cable clutter and supporting more efficient airflow in the chassis.
• Scalable storage architecture – supports building modular, scalable storage systems where capacity can be expanded by adding additional backplanes and drives, depending on chassis and controller capabilities.
• Serviceability and organization – a backplane layout allows easier drive access and replacement within the enclosure, supporting structured maintenance procedures in IT operations.
• Integration flexibility – suitable for use in a variety of storage-oriented server platforms, assuming mechanical and electrical compatibility with the target chassis and controller hardware.

As a specialized component, the BPN-SAS2-216EL2 is intended for system integrators and IT professionals who design or maintain storage infrastructures. Exact electrical, mechanical, and protocol specifications depend on the full system configuration and should be verified in the official technical documentation and chassis compatibility lists.

Note: Detailed parameters such as supported drive types, transfer rates, connector layout, enclosure management features, and redundancy options are not provided here and must be confirmed in the manufacturer’s datasheet before deployment.